The influences of a nanoparticle layer adherent to a surface on the thermal resistance at a liquid-solid interface were investigated by non-equilibrium classical molecular dynamics simulations. The interaction potential parameters between the liquid molecules and the wall atoms and those between the liquid molecules and the nanoparticle atoms were changed for the parametric studies. The variation of the interfacial thermal resistance caused by a nanoparticle layer was observed depending on the interaction potential parameter between the liquid molecules and the nanoparticle atoms and that between the liquid molecules and the surface atoms as well as the nanoparticle adherent density. Such variations of the interfacial thermal resistance caused by the nanoparticle adherent layer can be explained by the variation of the liquid molecular density profile at the liquid-solid interface.
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ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels
June 16–19, 2013
Sapporo, Japan
Conference Sponsors:
- Fluids Engineering Division
- Heat Transfer Division
ISBN:
978-0-7918-5559-1
PROCEEDINGS PAPER
Molecular Dynamics Study on the Influences of Nanoparticle Adherent Layer on Interfacial Thermal Resistance at a Liquid-Solid Interface
Masahiko Shibahara,
Masahiko Shibahara
Osaka University, Suita, Osaka, Japan
Search for other works by this author on:
Tatsuya Koike
Tatsuya Koike
Osaka University, Suita, Osaka, Japan
Search for other works by this author on:
Masahiko Shibahara
Osaka University, Suita, Osaka, Japan
Tatsuya Koike
Osaka University, Suita, Osaka, Japan
Paper No:
ICNMM2013-73086, V001T09A004; 2 pages
Published Online:
December 4, 2013
Citation
Shibahara, M, & Koike, T. "Molecular Dynamics Study on the Influences of Nanoparticle Adherent Layer on Interfacial Thermal Resistance at a Liquid-Solid Interface." Proceedings of the ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels. Sapporo, Japan. June 16–19, 2013. V001T09A004. ASME. https://doi.org/10.1115/ICNMM2013-73086
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