A heat sink integrating micro-channels with multiple jets was designed to achieve better heat transfer performance for chip cooling. Dielectric fluid FC-72 was the working fluid. The heat sink contained 11 micro-channels, and each channel was 0.8 mm high, 0.6 mm wide, and 12 mm in length. There were 3 or 5 pores on each micro-channel. The pore diameters were either 0.24 or 0.4 mm, and the pore spacing ranged from 1.5 to 3 mm. In the tests, the saturation temperature of cooling device was set at 30 and 50°C, and the volume flow rate ranged from 9.1 to 73.6 ml/min per channel (total flow rate = 100∼810 ml/min). The experimental result showed that heat transfer performance increased with increasing flow rate for single phase heat transfer. For heat flux between 20 and 100 kW/m2, the wall superheat decreases with increasing flow rate at a fixed heat flux. However, the influence of the flow rate diminished when the channels are in two phase heat transfer regime. Except for the lowest flow rate (9.1 ml/min), the heat transfer performance increased with increasing jet diameter/spacing ratios. The best surface had three nozzles of 0.4 mm diameter in 3.0 mm jet spacing. It had the lowest thermal resistance of 0.0611 K / W in the range of 200 ∼ 240 W heat input.

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