A novel 3ω-T type probe method is developed to investigate the thermal effusivity of micro/nanowires. In this method, a short hot wire subjected to an alternating current serves simultaneously as a heater and a thermometer, and a test wire is attached to the midpoint of the hot wire with an interstitial material. A measurement system based on a virtual lock-in is developed to measure the thermal impedance of the interposer and the thermal effusivity of the test wire. The same value of thermal effusivity is obtained with the presence of different interposers, and the interposer with small thermal impedance gives a decrease of the temperature oscillation of the hot wire. Using this method, the thermal resistances of bare metallic junctions are measured as a function of temperature. For the junction established by two crossed platinum wires with small diameters, the thermal contact resistance is found to decrease as temperature increases, which can possibly be explained the plastic deformation of the microscopic contacts.
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ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels
June 19–22, 2011
Edmonton, Alberta, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4464-9
PROCEEDINGS PAPER
3-Omega-T-Type Method for Measuring the Thermophysical Properties of Micro/Nanowires
Xing Zhang,
Xing Zhang
Tsinghua University, Beijing, China
Search for other works by this author on:
Jianli Wang
Jianli Wang
Tsinghua University, Beijing, China
Search for other works by this author on:
Xing Zhang
Tsinghua University, Beijing, China
Jianli Wang
Tsinghua University, Beijing, China
Paper No:
ICNMM2011-58018, pp. 707-712; 6 pages
Published Online:
May 11, 2012
Citation
Zhang, X, & Wang, J. "3-Omega-T-Type Method for Measuring the Thermophysical Properties of Micro/Nanowires." Proceedings of the ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 2. Edmonton, Alberta, Canada. June 19–22, 2011. pp. 707-712. ASME. https://doi.org/10.1115/ICNMM2011-58018
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