Using molecular dynamics simulations, an analysis of the thermal conductivity enhancement of a copper/argon nanofluid is performed. First, verification of an increase of as much as ∼30% in the thermal conductivity of the theoretical nanofluid over the corresponding base fluid, due to increasing nanoparticle concentration, is presented. Thermal energy transport is then decomposed into potential, kinetic, and virial components, based on the Green-Kubo autocorrelation function used to calculate thermal conductivity from the microscopic properties of the system. Analysis of these components showed that as the concentration of the nanoparticle increases, the energy transported through the system, due to collisions within the fluid, decreases by as much as 80%. Additionally, the nanofluid system increasingly displays characteristics of an amorphous-like material with increasing concentration. The decrease in energy exchange, due to collisions, suggests another physical mechanism is present for thermal energy transport. Therefore, it is proposed that thermal diffusion is the physical mechanism that more significantly affects thermal energy transport within a nanofluid than had been previously suggested.
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ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels
June 19–22, 2011
Edmonton, Alberta, Canada
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4464-9
PROCEEDINGS PAPER
Physical Mechanisms of Thermal Transport in Nanofluids Available to Purchase
John Shelton,
John Shelton
University of South Florida, Tampa, FL
Search for other works by this author on:
Frank Pyrtle, III
Frank Pyrtle, III
University of South Florida, Tampa, FL
Search for other works by this author on:
John Shelton
University of South Florida, Tampa, FL
Frank Pyrtle, III
University of South Florida, Tampa, FL
Paper No:
ICNMM2011-58246, pp. 255-258; 4 pages
Published Online:
May 11, 2012
Citation
Shelton, J, & Pyrtle, F, III. "Physical Mechanisms of Thermal Transport in Nanofluids." Proceedings of the ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 2. Edmonton, Alberta, Canada. June 19–22, 2011. pp. 255-258. ASME. https://doi.org/10.1115/ICNMM2011-58246
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