Micro heat sinks have a broad applicability in many fields such as aerospace applications, micro turbine cooling, micro reactors electronics cooling and micro biological applications. Among different types of micro heat sinks, those with micro pin-fins are becoming popular due to their enhanced heat removal performance. However, relevant experimental data is still scarce and few optimization studies are present in the literature. In order to effectively optimize their performance an extensive parametric study is necessary and should be based on a realistic model. Moreover, micro pin fin heat sinks should be optimized according to appropriate performance criteria depending on the application. The objective of this paper is to fill the research gap in micro pin fin heat sink optimization based on realistic configurations. In this paper, the parameters for micro pin optimization are the pin-fin height over diameter ratio (0.5<H/D<5) and the longitudinal and transverse pitch ratios (1.5<(SL, ST)/D<5), while Reynolds number and heat flux provided from the base of the micro heat sink are in the range of (1<Re<100) and (20<q(W/cm2)<500) respectively. In this research micro pin fin heat sinks are three dimensionally modeled on a one-to-one scale with the use of commercially available software COMSOL Multiphasics 3.5a. Full Navier-Stokes equations subjected to continuity and energy equations are solved for stationary conditions. To have increased computational efficiency, half of the heat sink is modeled with the use of a symmetry plane. In order to validate the use of numerical models parametric values from previous experimental data available in the literature are exactly taken and simulated. The numerical and experimental results show a good agreement. After this validation optimization study is performed using the three dimensional numerical models.
Skip Nav Destination
ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels collocated with 3rd Joint US-European Fluids Engineering Summer Meeting
August 1–5, 2010
Montreal, Quebec, Canada
Conference Sponsors:
- Fluids Engineering Division
ISBN:
978-0-7918-5450-1
PROCEEDINGS PAPER
Parameter Optimization of a Micro Heat Sink With Circular Pin-Fins
Mustafa Koz,
Mustafa Koz
Sabanci University, Istanbul, Turkey
Search for other works by this author on:
Ali Kosar
Ali Kosar
Sabanci University, Istanbul, Turkey
Search for other works by this author on:
Mustafa Koz
Sabanci University, Istanbul, Turkey
Ali Kosar
Sabanci University, Istanbul, Turkey
Paper No:
FEDSM-ICNMM2010-30473, pp. 531-539; 9 pages
Published Online:
March 1, 2011
Citation
Koz, M, & Kosar, A. "Parameter Optimization of a Micro Heat Sink With Circular Pin-Fins." Proceedings of the ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels collocated with 3rd Joint US-European Fluids Engineering Summer Meeting. ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B. Montreal, Quebec, Canada. August 1–5, 2010. pp. 531-539. ASME. https://doi.org/10.1115/FEDSM-ICNMM2010-30473
Download citation file:
25
Views
Related Articles
Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
J. Electron. Packag (June,2008)
Numerical Prediction of Flow and Heat Transfer in an Impingement Heat
Sink
J. Electron. Packag (March,1997)
Spray Cooling of High Aspect Ratio Open Microchannels
J. Heat Transfer (August,2007)
Related Chapters
Cooling of a Chip Utilizing a Heat Sink with Rectangular Fins
Everyday Heat Transfer Problems: Sensitivities to Governing Variables
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment