The present article presents a numerical investigation on the effect of thermal forcing for droplet formation in a T-junction. Thermal forcing, generated by a heater embedded into the channel wall, induces a non-uniform temperature field which results in the variation the fluids’ properties and affects the droplet formation process in a desirable manner. In the present article, droplet formation process is posed as an incompressible immiscible two-phase flow problem with the motion of the two-phases strongly coupled via the related interfacial conditions. It is governed by the three-dimensional Navier-Stokes and the energy equations. The interface is captured with a narrow-band particle level-set method. Solutions are obtained using a finite volume method on a staggered mesh. The numerical model is validated against droplet formation in a cross junction. With the formation of water droplet in oil within the squeezing formation regime as a case study, the physics underlying droplet formation process in a T-junction affected by a thermal forcing is investigated. The combined effect of variations in both viscosities and surface tension result in a larger droplet. It is believed that the behavior of fluids system under an imposed thermal forcing depends strongly on the characteristics of temperature dependent viscosities and surface tension.
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ASME 2009 7th International Conference on Nanochannels, Microchannels, and Minichannels
June 22–24, 2009
Pohang, South Korea
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4349-9
PROCEEDINGS PAPER
A Numerical Investigation of Thermally Mediated Droplet Formation in a T-Junction
Peng-Ching Ho,
Peng-Ching Ho
Nanyang Technological University, Singapore
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Yit Fatt Yap,
Yit Fatt Yap
Nanyang Technological University, Singapore
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Nam-Trung Nguyen,
Nam-Trung Nguyen
Nanyang Technological University, Singapore
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John Chai Chee Kiong,
John Chai Chee Kiong
Amoeba Technologies, Inc., Austin, TX
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Teck Neng Wong,
Teck Neng Wong
Nanyang Technological University, Singapore
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Levent Yobas
Levent Yobas
Institute of Microelectronics, Singapore
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Peng-Ching Ho
Nanyang Technological University, Singapore
Yit Fatt Yap
Nanyang Technological University, Singapore
Nam-Trung Nguyen
Nanyang Technological University, Singapore
John Chai Chee Kiong
Amoeba Technologies, Inc., Austin, TX
Teck Neng Wong
Nanyang Technological University, Singapore
Levent Yobas
Institute of Microelectronics, Singapore
Paper No:
ICNMM2009-82056, pp. 121-129; 9 pages
Published Online:
September 21, 2010
Citation
Ho, P, Yap, YF, Nguyen, N, Chai Chee Kiong, J, Wong, TN, & Yobas, L. "A Numerical Investigation of Thermally Mediated Droplet Formation in a T-Junction." Proceedings of the ASME 2009 7th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels. Pohang, South Korea. June 22–24, 2009. pp. 121-129. ASME. https://doi.org/10.1115/ICNMM2009-82056
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