Probe card detection plays important role during IC packaging and testing processes. Through the contact and penetration of probe tips into pad surfaces of IC, the functionality can be verified and the yielding ratio can be obtained. During the testing process, the probe card tips may deform, wear and more often attach some pad materials. These will reduce the life of probe card. In the proposed paper, a computer code based on molecular dynamics method was developed to study the deformation and penetration mechanism between probe tip and pad surface. The adhesion problem of Aluminum pad material on probe tip and the bulge profiles of pad surface after probing were studied. The simulation results of molecular dynamics show that the probing force increases when the inclination angle becomes small. The trend of probing force related with probe inclination is the same according to the simulation results of molecular dynamics and the finite element method. However, experimental study should be conducted for the future work to verify the simulation results.

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