The interface thermal resistance (ITR) of the interface between vertically aligned multiwalled carbon nanotube (MWCNT) arrays and the SiO2/Si and Inconel substrates was investigated. Experimental results were compared with theoretical predictions for the ITR across nanoconstrictions. The model considers classical constriction effects and contributions due to diffuse mismatch thermal resistance. Experimental values of the ITR are much larger than the model predictions. The observed discrepancy may be due to the imperfect mechanical contact between the tubes and substrate or additional contributions to ITR due to the presence of a catalyst layer at the interface.
- Nanotechnology Institute
Thermal Resistance of the Interface Between Vertically Aligned Multiwalled Carbon Nanotube Arrays and Inconel and SiO2/Si Substrates
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Son, Y, Pal, SK, Vajtai, R, Ajayan, PM, Siegel, RW, & Borca-Tasciuc, T. "Thermal Resistance of the Interface Between Vertically Aligned Multiwalled Carbon Nanotube Arrays and Inconel and SiO2/Si Substrates." Proceedings of the ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. Darmstadt, Germany. June 23–25, 2008. pp. 525-529. ASME. https://doi.org/10.1115/ICNMM2008-62343
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