This paper presents an investigation for two types of the grooves (rectangular and arc shapes) fabricated in the microchannel surfaces which leads to enhancement in single phase cooling. The pressure drop and heat transfer characteristic of the single phase microchannel heat sink were investigated numerically for laminar flow. For this purpose the conjugate heat transfer problem involving simultaneous determination of the temperature field in both solid and liquid regions was solved numerically. The heat sink includes an array of rectangular microchannels with grooved surface structures in the side walls and floor of the channel. The effect of these grooves on the pressure drop, outlet temperature of cooling fluid and the heat transfer rate were analyzed. The result showed that using a microchannel with grooved surfaces has a noticeable effect and heat removal rate can be increased using this technique. Also the grooves with the arc shapes have a better performance compared with a rectangular shape groove.
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ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels
June 23–25, 2008
Darmstadt, Germany
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4834-5
PROCEEDINGS PAPER
Numerical Investigation of Single Phase Heat Transfer Enhancement in a Microchannel With Grooved Surfaces
Nemat Baghernezhad,
Nemat Baghernezhad
Shiraz University, Shiraz, Iran
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Omid Abouali
Omid Abouali
Shiraz University, Shiraz, Iran
Search for other works by this author on:
Nemat Baghernezhad
Shiraz University, Shiraz, Iran
Omid Abouali
Shiraz University, Shiraz, Iran
Paper No:
ICNMM2008-62262, pp. 233-240; 8 pages
Published Online:
June 11, 2009
Citation
Baghernezhad, N, & Abouali, O. "Numerical Investigation of Single Phase Heat Transfer Enhancement in a Microchannel With Grooved Surfaces." Proceedings of the ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. Darmstadt, Germany. June 23–25, 2008. pp. 233-240. ASME. https://doi.org/10.1115/ICNMM2008-62262
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