In the paper presented is a solution of a conjugate problem of convective heat transfer on a plate combined with conduction within the plate, where uniform generation of heat is present. The equations governing the problem have been solved both numerically and analytically showing a good consistency. The principal achievement presented in the paper is a simple analytical model describing radial temperature distributions of the cooling fluid and a plate wall. Acquired relations enable examination of the influence of various parameters such as flow rate of cooling fluid, its inlet temperature and kind of the plate material on the temperature response of a cooled plate, representing the microprocessor. The presented model has been confronted against some experimental data from literature and the numerical solution of energy balance equations for fluid and a plate shows a satisfactory consistency.

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