Micro-channel heat sinks are currently at the forefront of cooling technologies for computer chips where the input heat flux is projected to exceed 100 W/cm2 [1, 2]. The quest for better heat-sink designs has produced different ideas, one of which is the idea of using multi-layered micro-channel heat sinks [3, 4]. The objectives of the present investigation were to conduct a detailed numerical study of the hydrodynamic and thermal behavior of a two-layered micro-channel heat sink and to compare the performance of the two-layered heat sink with that of a single-layered sink under laminar flow conditions.
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Three-Dimensional Analysis of Fluid Flow and Heat Transfer in Single- and Two-Layered Micro-Channel Heat Sinks
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Levac, ML, Soliman, HM, & Ormiston, SJ. "Three-Dimensional Analysis of Fluid Flow and Heat Transfer in Single- and Two-Layered Micro-Channel Heat Sinks." Proceedings of the ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. Darmstadt, Germany. June 23–25, 2008. pp. 1415-1416. ASME. https://doi.org/10.1115/ICNMM2008-62169
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