Microchannels used for cooling computer Silicon chips with heat flux boundary condition. Composite microchannels were not studied thoroughly. This paper introduces a new material at the bottom of the silicon ship with different thermal conductivity to enhance the heat flow rate and thus the cooling performance. A geometric model was considered and a numerical code was established to calculate the heat flow rate and Nusselt number at different interfaces of the microchannel. Different parameters were studied: composite materials, different working fluid, cross-sectional area of the composite material, heat flux at the boundary, and the fluid bulk temperature. Results shows how the heat flow rate change with the change of different parameters.

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