Micro Oscillation Heat Pipe Fabricated on Silicon Wafer

Heat transport characteristics of micro oscillation heat pipe have been investigated. A single winding flow path consists of 28 turns microchannels fabricated on a silicon wafer the size of which was 31mm×27mm. We used heat pipe with non-uniformed cross section. Equivalent diameters of channels were 0.19 and 0.10mm. Test fluid was R141b and liquid fractions were 0, 75, 85%. It was found that steady pulsating flow occurred by increasing the number of turns and the frequency of vibration has an effect on heat transfer performance.