In this paper, we studied liquid-solid slip by employing a mean-field free-energy lattice Boltzmann approach recently proposed [Zhang et al., Phy. Rev. E. 69, 032602, 2004]. With a general bounce-back no-slip boundary condition applied to the interface, liquid slip was observed because of the specific fluid-solid interaction. The slip length is clearly related to the interaction strength: the stronger the interaction, the less hydrophobic the surface and hence results in less slipping. Unlike other lattice Boltzmann models, a contact angle value between 0–180° can be generated here without using a less realistic repulsive fluid-solid interaction. We found that system size does not affect the absolute slip magnitude; however, the ratio of the slip length to system size increases quickly as the system becomes smaller, illustrating that slip becomes important in smaller-scale systems. A small negative slip length can also be produced with a strong fluid-solid attraction. These results are in qualitative agreement with those from experimental and molecular dynamics studies.
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ASME 3rd International Conference on Microchannels and Minichannels
June 13–15, 2005
Toronto, Ontario, Canada
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4185-5
PROCEEDINGS PAPER
On the Slip Mechanism of Microfluidics by Means of a Mean-Field Free-Energy Lattice Boltzmann Method
Junfeng Zhang,
Junfeng Zhang
University of Alberta, Edmonton, AB, Canada
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Daniel Y. Kwok
Daniel Y. Kwok
University of Alberta, Edmonton, AB, Canada
Search for other works by this author on:
Junfeng Zhang
University of Alberta, Edmonton, AB, Canada
Daniel Y. Kwok
University of Alberta, Edmonton, AB, Canada
Paper No:
ICMM2005-75170, pp. 517-522; 6 pages
Published Online:
November 11, 2008
Citation
Zhang, J, & Kwok, DY. "On the Slip Mechanism of Microfluidics by Means of a Mean-Field Free-Energy Lattice Boltzmann Method." Proceedings of the ASME 3rd International Conference on Microchannels and Minichannels. ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d. Toronto, Ontario, Canada. June 13–15, 2005. pp. 517-522. ASME. https://doi.org/10.1115/ICMM2005-75170
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