A bubble-powered micropump was fabricated and tested in this study. The micropump consists of a pair of nozzle-diffuser flow controller and a pumping chamber. The two-parallel micro line heaters were fabricated to be embedded in the silicon dioxide layer above a silicon wafer which serves as a base plate for the micropump. The pumping chamber, the pair of nozzle-diffuser unit and microchannels including the liquid inlet and outlet port were fabricated by etching through another silicon wafer. A glass wafer having two holes of inlet and outlet ports of liquid serve as upper plate of the pump. The sequential photographs of bubble nucleation, growth and collapse were visualized by CCD camera. Clearly liquid flow through the nozzle during the period of bubble growth and slight back flow of liquid at the initial period collapsing can be seen. The mass flow rate was found to be dependent on the duty ratio and the operation frequency. The mass flow rate decreases as the duty ratio increases in the micropump with either circular or square pumping chamber.
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ASME 3rd International Conference on Microchannels and Minichannels
June 13–15, 2005
Toronto, Ontario, Canada
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4185-5
PROCEEDINGS PAPER
Novel Fabrication and Testing of a Bubble-Powered Micropump
Jung-Yeul Jung,
Jung-Yeul Jung
Chung-Ang University, Seoul, Korea
Search for other works by this author on:
Ho-Young Kwak
Ho-Young Kwak
Chung-Ang University, Seoul, Korea
Search for other works by this author on:
Jung-Yeul Jung
Chung-Ang University, Seoul, Korea
Ho-Young Kwak
Chung-Ang University, Seoul, Korea
Paper No:
ICMM2005-75015, pp. 349-354; 6 pages
Published Online:
November 11, 2008
Citation
Jung, J, & Kwak, H. "Novel Fabrication and Testing of a Bubble-Powered Micropump." Proceedings of the ASME 3rd International Conference on Microchannels and Minichannels. ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d. Toronto, Ontario, Canada. June 13–15, 2005. pp. 349-354. ASME. https://doi.org/10.1115/ICMM2005-75015
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