A computational investigation of the heat transfer for a high performance integrated chip by using an electrohydrodynamic (EHD) pump was studied. This paper presents a fully computational system bundle with electro field, fluid flow and heat transfer for a cooling device. The micro pump provides the required pumping power by using the dipole moment generated from polarizing molecules and induces the flow to cool down the heat source. The computational domain of the micro channel for length and depth are kept in 1500μm and 500μm with parallel electrodes pitch (20μm, 40μm, 80μm). The effects of different applied voltage VE ranging from 100V to 500V, using oil as the working fluid and the heat flux of the heat source fixed at 2.5W/cm2 is investigated in detail. It is found that the EHD micro pump is more effective for lower channel pitch and higher applied voltage. For VE = 500V and electrodes pitch = 20μm, this study identifies a maximum performance of 49.36kPa in the pressure head and 9.55W/cm2 in the heat transfer. In addition, the performance of flow rate, liquid velocity and averaging Nusselt number for the specific condition are 0.94 L/min-mm2, 0.12 m/s, and 106.10. However, it also identifies the performance of the heat transfer for electrodes pitch = 40μm is about 146.0% of that for pitch = 80μm. But for pitch = 20μm, it is only 10.5% higher than that for pitch = 40μm.
Skip Nav Destination
ASME 3rd International Conference on Microchannels and Minichannels
June 13–15, 2005
Toronto, Ontario, Canada
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4185-5
PROCEEDINGS PAPER
3-D Numerical Analysis for Fluid Flow and Heat Transfer in a Micro Chip by Using an Electro-Hydrodynamic Micro-Pump Available to Purchase
Chia-Wen Lin,
Chia-Wen Lin
National Cheng-Kung University, Tainan, Taiwan
Search for other works by this author on:
Jiin-Yuh Jang
Jiin-Yuh Jang
National Cheng-Kung University, Tainan, Taiwan
Search for other works by this author on:
Chia-Wen Lin
National Cheng-Kung University, Tainan, Taiwan
Jiin-Yuh Jang
National Cheng-Kung University, Tainan, Taiwan
Paper No:
ICMM2005-75078, pp. 215-221; 7 pages
Published Online:
November 11, 2008
Citation
Lin, C, & Jang, J. "3-D Numerical Analysis for Fluid Flow and Heat Transfer in a Micro Chip by Using an Electro-Hydrodynamic Micro-Pump." Proceedings of the ASME 3rd International Conference on Microchannels and Minichannels. ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d. Toronto, Ontario, Canada. June 13–15, 2005. pp. 215-221. ASME. https://doi.org/10.1115/ICMM2005-75078
Download citation file:
10
Views
Related Proceedings Papers
Related Articles
Electrohydrodynamic Conduction Driven Single- and Two-Phase Flow in Microchannels With Heat Transfer
J. Heat Transfer (October,2013)
On the Modeling and Simulation of Ion Drag Electrohydrodynamic Micropumps
J. Fluids Eng (May,2011)
Thermal-Fluid MEMS Devices: A Decade of Progress and Challenges Ahead
J. Heat Transfer (November,2006)
Related Chapters
Introduction
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow
Thermoelectric Coolers
Thermal Management of Microelectronic Equipment
List of Commercial Codes
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow