Experiments and simulations have been performed in order to assess the feasibility of integrated single phase forced convection in silicon micro-channels for the cooling of electronics. A silicon micro-channel device has been fabricated with channel size of 100 by 300 μm. Cooling has been achieved with a heater dissipating up to 370 W (750 W/cm2) with a flow rate of 0.1 1/min. In this case the maximum junction temperature was 130°C. This paper presents characteristics of such a cooling device as well as its description and fabrication. Experimental results are shown and compared with simulations. A description of a rough optimization of the channels size is given followed by comments describing the main advantages and drawbacks regarding industrial feasibility.

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