A micro heat pipe will operate effectively by achieving its maximum possible heat transport capacity only if it is to operate at a specific temperature, i.e., design temperature. In reality, micro heat pipe’s may be required to operate at temperatures different from the design temperature. In this study, the heat transport capacity of an equilateral triangle micro heat pipe is investigated. The micro heat pipe is filled optimally with working fluid for a specific design temperature and operated at different operating temperatures. For this purpose, water, pentane and acetone was selected as the working fluids. From the numerical results obtained, it shows that the optimal charge level of the micro heat pipe is dependent on the operating temperature. Furthermore, the results also shows that if the micro heat pipe is to be operated at temperatures other than its design temperature, its heat transport capacity is limited by the occurrence of flooding at the condenser section or dryout at the evaporator section, depending on the operating temperature and type of working fluid. It is observed that when the micro heat pipe is operated at a higher temperature than its design temperature, the heat transport capacity increases but limited by the onset of dryout at the evaporator section. However, the heat transport capacity decreases if it is to be operated at lower temperatures than its design temperature due to the occurrence of flooding at condenser end. From the results obtained, we can conclude that the performance of a micro heat pipe is decreased if it is to be operated at temperatures other than its design temperature.
- Nanotechnology Institute
Heat Transport Limitation of a Triangular Micro Heat Pipe
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Sugumar, D, & Tio, KK. "Heat Transport Limitation of a Triangular Micro Heat Pipe." Proceedings of the ASME 2003 1st International Conference on Microchannels and Minichannels. 1st International Conference on Microchannels and Minichannels. Rochester, New York, USA. April 24–25, 2003. pp. 739-746. ASME. https://doi.org/10.1115/ICMM2003-1096
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