The pressure drop and heat transfer characteristics of heat sinks with circular micro-channels are investigated using the continuum model consisting of the conventional Navier-Stokes equations and the conventional energy equation. Developing flow (both hydrodynamically and thermally) is assumed in the fluid region and three-dimensional conjugate heat transfer is assumed in the solid region. Thermal results based on this approach are shown to be in good agreement with existing experimental data. Numerical results obtained for heat sinks with various geometries indicate that the heat absorbed by the fluid per unit length is high at the inlet and decreases steadily in the flow direction. As a result, the bulk temperature increases at a higher rate near the inlet. The geometry of the heat sink is shown to have a significant effect on the overall thermal resistance.
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ASME 2003 1st International Conference on Microchannels and Minichannels
April 24–25, 2003
Rochester, New York, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-3667-3
PROCEEDINGS PAPER
Three-Dimensional Thermal Analysis of Heat Sinks With Circular Cooling Micro-Channels Available to Purchase
C. J. Kroeker,
C. J. Kroeker
University of Manitoba, Winnipeg, MB, Canada
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H. M. Soliman,
H. M. Soliman
University of Manitoba, Winnipeg, MB, Canada
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S. J. Ormiston
S. J. Ormiston
University of Manitoba, Winnipeg, MB, Canada
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C. J. Kroeker
University of Manitoba, Winnipeg, MB, Canada
H. M. Soliman
University of Manitoba, Winnipeg, MB, Canada
S. J. Ormiston
University of Manitoba, Winnipeg, MB, Canada
Paper No:
ICMM2003-1095, pp. 731-738; 8 pages
Published Online:
February 24, 2009
Citation
Kroeker, CJ, Soliman, HM, & Ormiston, SJ. "Three-Dimensional Thermal Analysis of Heat Sinks With Circular Cooling Micro-Channels." Proceedings of the ASME 2003 1st International Conference on Microchannels and Minichannels. 1st International Conference on Microchannels and Minichannels. Rochester, New York, USA. April 24–25, 2003. pp. 731-738. ASME. https://doi.org/10.1115/ICMM2003-1095
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