The paper proposes a new design of a scalable, heat sink containing 3-D micro/nano network, utilizing liquid mixed with nano phase change materials (NPCM) and having a high surface-to-volume ratio geometry. The conceptual design is capable of reaching 105 W/cm3 using encapsulated nano-size phase change materials, which would result in an order of magnitude higher cooling capacity than typical microchannel heat sink of the same volume and same pumping power. It is also scalable to submicron range, resulting even higher cooling capacity. An analysis for a working model (10 × 10 × 1 mm) is presented utilizing energy conservation principle and uniform temperature and uniform heat flux boundary conditions. The average phase change heat transfer coefficient is obtained using the numerical model results. A process of micro electrochemical deposition to fabricate the target model is illustrated, and the issues associated with system-level applications are discussed.
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ASME 2003 1st International Conference on Microchannels and Minichannels
April 24–25, 2003
Rochester, New York, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-3667-3
PROCEEDINGS PAPER
Design Analysis of a 3-D, Ultra-High Performance, Scalable, Micro Convective Heat Sink With NPCM
Y.-X. Tao,
Y.-X. Tao
Florida International University, Miami, FL
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R. Moreno,
R. Moreno
Florida International University, Miami, FL
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Y. Hao
Y. Hao
Florida International University, Miami, FL
Search for other works by this author on:
Y.-X. Tao
Florida International University, Miami, FL
R. Moreno
Florida International University, Miami, FL
Y. Hao
Florida International University, Miami, FL
Paper No:
ICMM2003-1093, pp. 721-730; 10 pages
Published Online:
February 24, 2009
Citation
Tao, Y, Moreno, R, & Hao, Y. "Design Analysis of a 3-D, Ultra-High Performance, Scalable, Micro Convective Heat Sink With NPCM." Proceedings of the ASME 2003 1st International Conference on Microchannels and Minichannels. 1st International Conference on Microchannels and Minichannels. Rochester, New York, USA. April 24–25, 2003. pp. 721-730. ASME. https://doi.org/10.1115/ICMM2003-1093
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