Fluid flow and heat transfer in micro-channel has received attention in developing electronic element cooling systems and in designing thermal elements of micro machines and refrigerators. In the present experiment, pressurized water in the chamber flushed out of a vertical capillary tube of 0.5mm in inner diameter and 1150mm in length. The outer surface of the tube was insulated. The chamber excess pressure was changed from 0.1 MPa to 0.6 MPa and also the inlet water temperature was widely varied. At low excess pressures, the flow is liquid single-phase flow but at high excess pressures, phase change (flushing) takes place inside and/or near the exit end of the tube and the flow becomes two-phase flow of oscillatory or intermittent. Mass flow rate as well as tube wall temperature (distribution and fluctuation) were measured, and the aspect of flushing at the tube exit end was observed using high-speed video movie. It is found that the flow regime can be classified into three (single-phase, two-phase and transient flow regimes) depending on the chamber excess pressure.
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ASME 2003 1st International Conference on Microchannels and Minichannels
April 24–25, 2003
Rochester, New York, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-3667-3
PROCEEDINGS PAPER
Characteristics of Water Flow in a Vertical Micro Tube
Xiaoping Wang,
Xiaoping Wang
University of Tokyo, Tokyo, Japan
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Makoto Watanabe,
Makoto Watanabe
University of Tokyo, Tokyo, Japan
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Masahiro Shoji
Masahiro Shoji
University of Tokyo, Tokyo, Japan
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Xiaoping Wang
University of Tokyo, Tokyo, Japan
Makoto Watanabe
University of Tokyo, Tokyo, Japan
Masahiro Shoji
University of Tokyo, Tokyo, Japan
Paper No:
ICMM2003-1081, pp. 643-650; 8 pages
Published Online:
February 24, 2009
Citation
Wang, X, Watanabe, M, & Shoji, M. "Characteristics of Water Flow in a Vertical Micro Tube." Proceedings of the ASME 2003 1st International Conference on Microchannels and Minichannels. 1st International Conference on Microchannels and Minichannels. Rochester, New York, USA. April 24–25, 2003. pp. 643-650. ASME. https://doi.org/10.1115/ICMM2003-1081
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