With boiling flows in very smooth heated channels, in general, the bulk liquid is superheated before the bubble formation takes place at the wall surface. Thus the eruptive boiling occurs once the superheat requirement for nucleation is satisfied, and this can be a source of flow instability. In the present work, a preliminary consideration has been given to predict the limiting heat flux for stable boiling in microchannels. The minimum heat-flux value to avoid this eruptive boiling is inversely proportional to the square of the channel diameter, and becomes enormously large as the channel diameter decreases. The stable heat-flux limit also depends on the cavity size in the channel wall. A map showing stable nucleation criteria was given and discussions were made on the simplifying assumptions made for the analysis.
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ASME 2003 1st International Conference on Microchannels and Minichannels
April 24–25, 2003
Rochester, New York, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-3667-3
PROCEEDINGS PAPER
Preliminary Consideration to Avoid Eruptive Flow Boiling in Microchannels
Dong Woon Jeong,
Dong Woon Jeong
Korea Advanced Institute of Science and Technology, Daejeon, Korea
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Kwang Uoong Koh,
Kwang Uoong Koh
Korea Advanced Institute of Science and Technology, Daejeon, Korea
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Sang Yong Lee
Sang Yong Lee
Korea Advanced Institute of Science and Technology, Daejeon, Korea
Search for other works by this author on:
Dong Woon Jeong
Korea Advanced Institute of Science and Technology, Daejeon, Korea
Kwang Uoong Koh
Korea Advanced Institute of Science and Technology, Daejeon, Korea
Sang Yong Lee
Korea Advanced Institute of Science and Technology, Daejeon, Korea
Paper No:
ICMM2003-1076, pp. 609-614; 6 pages
Published Online:
February 24, 2009
Citation
Jeong, DW, Koh, KU, & Lee, SY. "Preliminary Consideration to Avoid Eruptive Flow Boiling in Microchannels." Proceedings of the ASME 2003 1st International Conference on Microchannels and Minichannels. 1st International Conference on Microchannels and Minichannels. Rochester, New York, USA. April 24–25, 2003. pp. 609-614. ASME. https://doi.org/10.1115/ICMM2003-1076
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