Microchannel heat sinks are widely regarded as being amongst the most effective heat removal techniques from space-constrained electronic devices. However, the fluid flow and heat transfer in microchannels is not fully understood. The pumping requirements for flow through microchannels are also very high and none of the micropumps in the literature are truly suitable for this application. A wide-ranging research program on microchannel heat sinks and micropumps is underway in the Electronics Cooling Laboratory at Purdue University. This article provides an overview of the research being conducted to understand fluid flow and heat transfer in microchannels and to identify pumping requirements and suitable mechanisms for pumping in microchannels.
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ASME 2003 1st International Conference on Microchannels and Minichannels
April 24–25, 2003
Rochester, New York, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-3667-3
PROCEEDINGS PAPER
Single-Phase Flow and Heat Transport in Microchannel Heat Sinks Available to Purchase
Suresh V. Garimella,
Suresh V. Garimella
Purdue University, West Lafayette, IN
Search for other works by this author on:
Vishal Singhal
Vishal Singhal
Purdue University, West Lafayette, IN
Search for other works by this author on:
Suresh V. Garimella
Purdue University, West Lafayette, IN
Vishal Singhal
Purdue University, West Lafayette, IN
Paper No:
ICMM2003-1018, pp. 159-169; 11 pages
Published Online:
February 24, 2009
Citation
Garimella, SV, & Singhal, V. "Single-Phase Flow and Heat Transport in Microchannel Heat Sinks." Proceedings of the ASME 2003 1st International Conference on Microchannels and Minichannels. 1st International Conference on Microchannels and Minichannels. Rochester, New York, USA. April 24–25, 2003. pp. 159-169. ASME. https://doi.org/10.1115/ICMM2003-1018
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