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Proceedings Papers

ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
  • Heat Transfer Division
  • Fluids Engineering Division
ISBN:
978-0-7918-5687-1
ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels

Advanced Fabrication and Manufacturing

Novel Fabrication Methods for Micro- and Nano- Scale Devices

ICNMM 2015; V001T01A001doi:https://doi.org/10.1115/ICNMM2015-48366

Emerging Technology Frontiers

Nanoscale Heat Transport and Characterization Methods

ICNMM 2015; V001T02A001doi:https://doi.org/10.1115/ICNMM2015-48281

Power Electronics and Electric Machines

ICNMM 2015; V001T02A002doi:https://doi.org/10.1115/ICNMM2015-48020
ICNMM 2015; V001T02A003doi:https://doi.org/10.1115/ICNMM2015-48031

Thermal Management: Mobile Applications

ICNMM 2015; V001T02A004doi:https://doi.org/10.1115/ICNMM2015-48835

Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices

Biomicrofluidics and Lab-on-a-Chip

ICNMM 2015; V001T03A001doi:https://doi.org/10.1115/ICNMM2015-48192
ICNMM 2015; V001T03A002doi:https://doi.org/10.1115/ICNMM2015-48307
ICNMM 2015; V001T03A003doi:https://doi.org/10.1115/ICNMM2015-48494
ICNMM 2015; V001T03A004doi:https://doi.org/10.1115/ICNMM2015-48498
ICNMM 2015; V001T03A005doi:https://doi.org/10.1115/ICNMM2015-48520
ICNMM 2015; V001T03A006doi:https://doi.org/10.1115/ICNMM2015-48556

Fuel Cells and Other Energy Devices

ICNMM 2015; V001T03A007doi:https://doi.org/10.1115/ICNMM2015-48095
ICNMM 2015; V001T03A008doi:https://doi.org/10.1115/ICNMM2015-48225
ICNMM 2015; V001T03A009doi:https://doi.org/10.1115/ICNMM2015-48233
ICNMM 2015; V001T03A010doi:https://doi.org/10.1115/ICNMM2015-48296
ICNMM 2015; V001T03A011doi:https://doi.org/10.1115/ICNMM2015-48527
ICNMM 2015; V001T03A012doi:https://doi.org/10.1115/ICNMM2015-48822
ICNMM 2015; V001T03A013doi:https://doi.org/10.1115/ICNMM2015-48833

Mixing, Mass Transfer, and Chemical Reactions

ICNMM 2015; V001T03A014doi:https://doi.org/10.1115/ICNMM2015-48416

Transport in Membranes

ICNMM 2015; V001T03A015doi:https://doi.org/10.1115/ICNMM2015-48222
ICNMM 2015; V001T03A016doi:https://doi.org/10.1115/ICNMM2015-48238
ICNMM 2015; V001T03A017doi:https://doi.org/10.1115/ICNMM2015-48725

Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Continuum/Atomistic Modeling and Simulations

ICNMM 2015; V001T04A001doi:https://doi.org/10.1115/ICNMM2015-48030
ICNMM 2015; V001T04A002doi:https://doi.org/10.1115/ICNMM2015-48078
ICNMM 2015; V001T04A003doi:https://doi.org/10.1115/ICNMM2015-48126
ICNMM 2015; V001T04A004doi:https://doi.org/10.1115/ICNMM2015-48264
ICNMM 2015; V001T04A005doi:https://doi.org/10.1115/ICNMM2015-48388
ICNMM 2015; V001T04A006doi:https://doi.org/10.1115/ICNMM2015-48428
ICNMM 2015; V001T04A007doi:https://doi.org/10.1115/ICNMM2015-48569
ICNMM 2015; V001T04A008doi:https://doi.org/10.1115/ICNMM2015-48716
ICNMM 2015; V001T04A009doi:https://doi.org/10.1115/ICNMM2015-48723

Electrokinetic Flows

ICNMM 2015; V001T04A010doi:https://doi.org/10.1115/ICNMM2015-48075
ICNMM 2015; V001T04A011doi:https://doi.org/10.1115/ICNMM2015-48089
ICNMM 2015; V001T04A012doi:https://doi.org/10.1115/ICNMM2015-48330
ICNMM 2015; V001T04A013doi:https://doi.org/10.1115/ICNMM2015-48343
ICNMM 2015; V001T04A014doi:https://doi.org/10.1115/ICNMM2015-48528
ICNMM 2015; V001T04A015doi:https://doi.org/10.1115/ICNMM2015-48547
ICNMM 2015; V001T04A016doi:https://doi.org/10.1115/ICNMM2015-48776

Micro/Nano Structures in Phase Change Heat Transfer

ICNMM 2015; V001T04A017doi:https://doi.org/10.1115/ICNMM2015-48026
ICNMM 2015; V001T04A018doi:https://doi.org/10.1115/ICNMM2015-48120
ICNMM 2015; V001T04A019doi:https://doi.org/10.1115/ICNMM2015-48202
ICNMM 2015; V001T04A020doi:https://doi.org/10.1115/ICNMM2015-48203
ICNMM 2015; V001T04A021doi:https://doi.org/10.1115/ICNMM2015-48317
ICNMM 2015; V001T04A022doi:https://doi.org/10.1115/ICNMM2015-48352
ICNMM 2015; V001T04A023doi:https://doi.org/10.1115/ICNMM2015-48406
ICNMM 2015; V001T04A024doi:https://doi.org/10.1115/ICNMM2015-48508
ICNMM 2015; V001T04A025doi:https://doi.org/10.1115/ICNMM2015-48687

Pool Boiling and Condensation

ICNMM 2015; V001T04A026doi:https://doi.org/10.1115/ICNMM2015-48212
ICNMM 2015; V001T04A027doi:https://doi.org/10.1115/ICNMM2015-48459
ICNMM 2015; V001T04A028doi:https://doi.org/10.1115/ICNMM2015-48477
ICNMM 2015; V001T04A029doi:https://doi.org/10.1115/ICNMM2015-48481
ICNMM 2015; V001T04A030doi:https://doi.org/10.1115/ICNMM2015-48509
ICNMM 2015; V001T04A031doi:https://doi.org/10.1115/ICNMM2015-48661

Single Phase Flows

ICNMM 2015; V001T04A032doi:https://doi.org/10.1115/ICNMM2015-48034
ICNMM 2015; V001T04A033doi:https://doi.org/10.1115/ICNMM2015-48054
ICNMM 2015; V001T04A034doi:https://doi.org/10.1115/ICNMM2015-48074
ICNMM 2015; V001T04A035doi:https://doi.org/10.1115/ICNMM2015-48107
ICNMM 2015; V001T04A036doi:https://doi.org/10.1115/ICNMM2015-48128
ICNMM 2015; V001T04A037doi:https://doi.org/10.1115/ICNMM2015-48190
ICNMM 2015; V001T04A038doi:https://doi.org/10.1115/ICNMM2015-48294
ICNMM 2015; V001T04A039doi:https://doi.org/10.1115/ICNMM2015-48461
ICNMM 2015; V001T04A040doi:https://doi.org/10.1115/ICNMM2015-48463
ICNMM 2015; V001T04A041doi:https://doi.org/10.1115/ICNMM2015-48500
ICNMM 2015; V001T04A042doi:https://doi.org/10.1115/ICNMM2015-48595
ICNMM 2015; V001T04A043doi:https://doi.org/10.1115/ICNMM2015-48657
ICNMM 2015; V001T04A044doi:https://doi.org/10.1115/ICNMM2015-48701
ICNMM 2015; V001T04A045doi:https://doi.org/10.1115/ICNMM2015-48799

Thin Film/Surface Tension Driven Flows

ICNMM 2015; V001T04A046doi:https://doi.org/10.1115/ICNMM2015-48223
ICNMM 2015; V001T04A047doi:https://doi.org/10.1115/ICNMM2015-48826

Two Phase Flows

ICNMM 2015; V001T04A048doi:https://doi.org/10.1115/ICNMM2015-48047
ICNMM 2015; V001T04A049doi:https://doi.org/10.1115/ICNMM2015-48048
ICNMM 2015; V001T04A050doi:https://doi.org/10.1115/ICNMM2015-48117
ICNMM 2015; V001T04A051doi:https://doi.org/10.1115/ICNMM2015-48143
ICNMM 2015; V001T04A052doi:https://doi.org/10.1115/ICNMM2015-48167
ICNMM 2015; V001T04A053doi:https://doi.org/10.1115/ICNMM2015-48194
ICNMM 2015; V001T04A054doi:https://doi.org/10.1115/ICNMM2015-48199
ICNMM 2015; V001T04A055doi:https://doi.org/10.1115/ICNMM2015-48221
ICNMM 2015; V001T04A056doi:https://doi.org/10.1115/ICNMM2015-48251
ICNMM 2015; V001T04A057doi:https://doi.org/10.1115/ICNMM2015-48272
ICNMM 2015; V001T04A058doi:https://doi.org/10.1115/ICNMM2015-48304
ICNMM 2015; V001T04A059doi:https://doi.org/10.1115/ICNMM2015-48325
ICNMM 2015; V001T04A060doi:https://doi.org/10.1115/ICNMM2015-48337
ICNMM 2015; V001T04A061doi:https://doi.org/10.1115/ICNMM2015-48426
ICNMM 2015; V001T04A062doi:https://doi.org/10.1115/ICNMM2015-48451
ICNMM 2015; V001T04A063doi:https://doi.org/10.1115/ICNMM2015-48464
ICNMM 2015; V001T04A064doi:https://doi.org/10.1115/ICNMM2015-48482
ICNMM 2015; V001T04A065doi:https://doi.org/10.1115/ICNMM2015-48555
ICNMM 2015; V001T04A066doi:https://doi.org/10.1115/ICNMM2015-48561
ICNMM 2015; V001T04A067doi:https://doi.org/10.1115/ICNMM2015-48663
ICNMM 2015; V001T04A068doi:https://doi.org/10.1115/ICNMM2015-48721
ICNMM 2015; V001T04A069doi:https://doi.org/10.1115/ICNMM2015-48821
ICNMM 2015; V001T04A070doi:https://doi.org/10.1115/ICNMM2015-48834

MEMS and NEMS

N/MEMS: Emerging Technology

ICNMM 2015; V001T05A001doi:https://doi.org/10.1115/ICNMM2015-48765

Thermal Management

Air Cooling: Heat Sink to System Level

ICNMM 2015; V001T06A001doi:https://doi.org/10.1115/ICNMM2015-48043

Thermal Management: Phase Change Materials

ICNMM 2015; V001T06A002doi:https://doi.org/10.1115/ICNMM2015-48025

Thermal Management Using Micro Channels, Jets, Sprays

Advanced and Oscillating Heat Pipes

ICNMM 2015; V001T07A001doi:https://doi.org/10.1115/ICNMM2015-48438
ICNMM 2015; V001T07A002doi:https://doi.org/10.1115/ICNMM2015-48440

Cold Plate Integration

ICNMM 2015; V001T07A003doi:https://doi.org/10.1115/ICNMM2015-48373
ICNMM 2015; V001T07A004doi:https://doi.org/10.1115/ICNMM2015-48460

Embedded Cooling for 3D ICs

ICNMM 2015; V001T07A005doi:https://doi.org/10.1115/ICNMM2015-48830

Flow-Boiling Experimental Investigations

ICNMM 2015; V001T07A006doi:https://doi.org/10.1115/ICNMM2015-48263
ICNMM 2015; V001T07A007doi:https://doi.org/10.1115/ICNMM2015-48300
ICNMM 2015; V001T07A008doi:https://doi.org/10.1115/ICNMM2015-48486
ICNMM 2015; V001T07A009doi:https://doi.org/10.1115/ICNMM2015-48819

Liquid and Synthetic Jets

ICNMM 2015; V001T07A010doi:https://doi.org/10.1115/ICNMM2015-48588
ICNMM 2015; V001T07A011doi:https://doi.org/10.1115/ICNMM2015-48823

Single Phase Cooling Fundamentals

ICNMM 2015; V001T07A012doi:https://doi.org/10.1115/ICNMM2015-48404
ICNMM 2015; V001T07A013doi:https://doi.org/10.1115/ICNMM2015-48515

Two Phase Boiling Computational Modeling Challenges

ICNMM 2015; V001T07A014doi:https://doi.org/10.1115/ICNMM2015-48098
ICNMM 2015; V001T07A015doi:https://doi.org/10.1115/ICNMM2015-48645

Vapor Chambers and Condensation

ICNMM 2015; V001T07A016doi:https://doi.org/10.1115/ICNMM2015-48196
ICNMM 2015; V001T07A017doi:https://doi.org/10.1115/ICNMM2015-48198
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