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Keywords: thermal management
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Proceedings Papers

Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T01A010, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-107575
...Proceedings of the ASME 2023 Heat Transfer Summer Conference HT2023 July 10-12, 2023, Washington, DC HT2023-107575 PERFORMANCE COMPARISON OF THERMAL MANAGEMENT SYSTEMS FOR BATTERY PACKS BASED ON NUMERICAL SIMULATION Sowmya Raghu University of South Carolina Columbia, SC Roya Rajabi University...
Proceedings Papers

Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T10A004, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-107072
... the model. The model was then used to study the effects of different fin geometries and heat loads. phase change material heatsink thermal management Proceedings of the ASME 2023 Heat Transfer Summer Conference HT2023 July 10-12, 2023, Washington, DC HT2023-107072 EFFECT OF MODIFIED FIN...
Proceedings Papers

Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T07A001, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-105745
... channel, and also, indicate that near critical carbon dioxide is a good candidate for heat removal in components generating high heat fluxes especially electronic components. thermal management boiling heat transfer two-phase flow micro flow Joule-Thomson effect active cooling electronic...
Proceedings Papers

Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A002, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-85400
... Abstract With increasing thermal footprint in electronic packages, metal lattices offer avenues for better thermal management in passively cooled heat sinks. Combined with the advances in metal additive manufacturing, these can be leveraged to realize complex designs that offer superior heat...
Proceedings Papers

Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T12A009, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-8998
... utilized for several decades as the most cost-effective cooling technique for electronic cooling applications. However, the existing thermal management solutions are unable to maintain the temperature of the next generation of complex electronic systems within acceptable limits without adding considerable...
Proceedings Papers

Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T10A008, July 14–17, 2019
Publisher: American Society of Mechanical Engineers
Paper No: HT2019-3651
... to increasing power densities and decreasing device footprints, thermal management has become an important design requirement in modern electronic devices. Loop heat pipes are phase change-based devices that can absorb and transport large heat fluxes via the latent heat of evaporation of a working fluid...
Proceedings Papers

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 113-127, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88133
.... It is also shown that the dependence of water transport on the CPSRs can be significantly influenced by the use of a hydrophobic air filter layer at the cathode. fuel cell passive DMFC two-phase mass transport model capillary pressure water transport thermal management 1 Copyright © 2009...
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 267-274, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32537
... resistance as a function of hydrodynamic power consumed was formulated, thus facilitating the selection of a cold plate for a practical application. Electronics Cooling Thermal Management Liquid Cooling Primary Heat Exchangers Cold Plates 1 Copyright © 2007 by ASME Proceedings of HT2007 2007...
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 313-320, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32623
... to axial conduction through the adiabatic section of the prototype VCHP. However, excluding these low ambient temperatures, the VCHP provides a significant reduction in power consumption compared to a TEM. Thermal Management Precision Temperature Control Variable Conductance Heat Pipe...
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 893-900, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32519
... 07 04 2009 Thermal management has become a key point in the development of contemporary electronics systems. It is evident that heat fluxes are currently approaching the limits of conventional forced air cooling, and that liquid cooling technologies are now under consideration. Most...
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 817-823, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32596
... to the conduction of current. Thermal impedance measurements showed a strong dependency of contact resistance with percentage loading. Finally, the feasibility of deploying carbon nanotube-polymer composites as practical thermal interface materials for electronics thermal management is discussed. Thermal...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 3, 355-360, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72425
... 03 04 2009 It is well known that drilling is one of the most difficult metalwork cutting operations, not only from the viewpoint of manufacturing process, but also from the thermal management point of view of the drill. For the drilling process, due to its long time continuous metal...
Proceedings Papers

Proc. ASME. HT-FED2004, Volume 1, 965-971, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56528
... 03 03 2009 The recent miniaturization of electronic devices and compaction of computer systems will soon lead to data centers with power densities of the order of 300 W/ft 2 . At these levels, traditional thermal management techniques are unlikely to suffice. To enable the dynamic...
Proceedings Papers

Proc. ASME. HT-FED2004, Volume 3, 661-666, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56410
... 03 03 2009 As diode pumped solid-state lasers become more powerful, improved thermal management techniques are required. Minimizing thermal gradients in the laser increases performance and reduces thermal stress, which can cause failure by fracturing. Two-phase sprays provide...