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Proc. ASME. HT2005, Heat Transfer: Volume 4, 543-547, July 17–22, 2005
Paper No: HT2005-72380
... the thermal management of high power electronic component on spacecraft. This study presents a novel CPL with a semi-arc porous evaporator in 1U server on the ground with a horizontal position and scale down the whole device to the miniature size (range from mm to cm). This miniature-CPL is made of aluminum...