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Keywords: Electronic Cooling
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Proceedings Papers

Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T07A001, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-105745
... thermal management boiling heat transfer two-phase flow micro flow Joule-Thomson effect active cooling electronic cooling Abstract A comparison between two microchannels is studied with carbon dioxide near critical condition — one with an orifice and another without orifice...
Proceedings Papers

Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T12A001, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-80024
... sink; pin fin; electronic cooling; convection heat transfer; slotted fin, perforated fin CD CFL D F i j J k L N Nu P Pr Q Re S S/a T u U x, y, z Greek Symbols Dx, Dy, Dz T Subscript total tot d f ht s w z Superscript * Drag coefficient Courant-Friedrichs-Lewy number Cylinder diameter Force...
Proceedings Papers

Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 513-522, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58474
... temperatures and pressures and the individual heat input to each evaporator determines the evaporator temperatures. Setting up the evaporators in parallel allows for more cooling than series. boiling multi evaporators capillary pumping mechanical pumping electronic cooling 1 EXPERIMENTAL ANALYSIS...
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 671-679, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32754
... 07 04 2009 The decreasing physical size of microchips accompanied by the increasing heat flux to be dissipated has led to the study of possible new innovative electronic cooling methods. Jet cooling has been successfully implemented in a variety of industrial applications and its...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 2, 53-62, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72204
... during boiling of the working fluid, and a condenser, e the absorbed heat is rejected. Water is a preferred ing fluid for boiling heat transfer due to its excellent al properties. Using water at sub-atmospheric conditions in initiation of boiling at low temperatures, which is sary for electronics cooling...
Proceedings Papers

Proc. ASME. HT2005, Heat Transfer: Volume 1, 617-626, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72526
... Mixed Convection Open Cavity Electronic Cooling Experimental Investigation In this paper mixed convection in an open cavity with a heated wall bounded by a horizontal unheated plate is investigated experimentally. The cavity has the heated wall on the opposite side of the forced inflow...
Proceedings Papers

Proc. ASME. HT-FED2004, Volume 1, 133-141, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56133
... Constructal theory Electronic cooling natural convection forced convection maximal heat transfer density packing The present paper is a review of a new conceptual design for the maximization of heat transfer density (i.e., heat transfer rate per unit of volume) in channels installed...
Proceedings Papers

Proc. ASME. HT2003, Heat Transfer: Volume 3, 397-410, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47050
..., smooth liquid-gas interface, and strong entrainment and deposition effects are incorporated into the model. The model shows good agreement with experimental data for water-cooled heat sinks. 18 12 2008 micro-channel heat sink adiabatic two-phase flow flow boiling electronic cooling...