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Heat Transfer in Electronic Devices and Information Technology
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Proceedings Papers

Effect of Design Variables on Voids and Thermal Performance of QFN Packages

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Farbod Askari, Leila Jannesari Ladani, Abhijit Dasgupta, Matti Rahko, Jussi Sarkka
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 705-712, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32067
https://doi.org/10.1115/HT2007-32067
View Paper titled, Effect of Design Variables on Voids and Thermal Performance of QFN Packages
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Topics: Design, Finite element analysis, Solders
Proceedings Papers

Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment

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Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 713-718, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32100
https://doi.org/10.1115/HT2007-32100
View Paper titled, Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment
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Topics: Electronic equipment, Flow (Dynamics), Plates (structures), Shapes, Experimental design, Reynolds number, Natural convection
Proceedings Papers

Numerical Solution Methodology for Compact Thermal Models of Electronic Packages

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Rohit Dev Gupta, Vinayak Eswaran
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 719-726, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32139
https://doi.org/10.1115/HT2007-32139
View Paper titled, Numerical Solution Methodology for Compact Thermal Models of Electronic Packages
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Topics: Electronic packages, Computational fluid dynamics, Convection, Junctions, Temperature, Algebra, Cooling, Fluid dynamics, Fluids, Heat transfer
Proceedings Papers

Robust Thermal Design for Power Device Package Using Response Surface Method and Monte Carlo Simulation

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Yasuyuki Yokono, Katsumi Hisano, Kenji Hirohata
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 727-732, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32168
https://doi.org/10.1115/HT2007-32168
View Paper titled, Robust Thermal Design for Power Device Package Using Response Surface Method and Monte Carlo Simulation
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Topics: Design, Response surface methodology, Simulation, Thermal resistance, Errors, Heat conduction, Manufacturing, Cooling, Dimensions, Solders
Proceedings Papers

Evaluation of Condenser Transient Heat Transfer Behavior of the Small Scale Capillary-Pumped Loop

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Hung-Wen Lin, Yu-An Lin, Wei-Keng Lin
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 733-737, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32320
https://doi.org/10.1115/HT2007-32320
View Paper titled, Evaluation of Condenser Transient Heat Transfer Behavior of the Small Scale Capillary-Pumped Loop
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Topics: Condensers (steam plant), Transient heat transfer, Temperature, Heat, Simulation, Density, Flow (Dynamics), Porous materials, Simulation results, Steady state
Proceedings Papers

Optimal Design of Coldplates for CPU Coolers

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C. N. Rasmussen, C. B. Terp
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 739-745, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32376
https://doi.org/10.1115/HT2007-32376
View Paper titled, Optimal Design of Coldplates for CPU Coolers
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Topics: Computational fluid dynamics, Coolers, Cooling, Design, Engineering simulation, Heat, Heat transfer, Heat transfer coefficients, Simulation, Thermal conductivity
Proceedings Papers

The Effect of Nozzle Geometry on Pressure Drop and Heat Transfer to Free Surface Liquid Jet Arrays

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Brian P. Whelan, Anthony J. Robinson
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 747-756, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32384
https://doi.org/10.1115/HT2007-32384
View Paper titled, The Effect of Nozzle Geometry on Pressure Drop and Heat Transfer to Free Surface Liquid Jet Arrays
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Topics: Geometry, Heat transfer, Nozzles, Pressure drop, Cooling, Jets, Heat, Copper, Electronic components, Flow (Dynamics)
Proceedings Papers

Effects of Clearance Between Heating Walls on Natural Cooling in a Channel Model of Electronic Equipment

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Yasushi Nishino, Ryoji Imai, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 757-762, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32723
https://doi.org/10.1115/HT2007-32723
View Paper titled, Effects of Clearance Between Heating Walls on Natural Cooling in a Channel Model of Electronic Equipment
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Topics: Clearances (Engineering), Cooling, Electronic equipment, Heating, Temperature, Copper, Modeling, Electronic products, Flow (Dynamics), Natural convection
Proceedings Papers

Heat Transport Characteristics of a Pulsating Heat Pipe

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Takao Nagasaki, Toshiyuki Hokazono, Yutaka Ito
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 763-770, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32731
https://doi.org/10.1115/HT2007-32731
View Paper titled, Heat Transport Characteristics of a Pulsating Heat Pipe
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Topics: Heat, Heat pipes, Water, Stress, Cooling, Copper, Diamonds, Fluctuations (Physics), Fluids, Heating
Proceedings Papers

Electro-Thermal Analysis of Submicron Si MOSFET With Zoned Mesh Based on Semiconductor Physics Theory

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Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 771-778, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32745
https://doi.org/10.1115/HT2007-32745
View Paper titled, Electro-Thermal Analysis of Submicron Si MOSFET With Zoned Mesh Based on Semiconductor Physics Theory
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Topics: MOSFET transistors, Physics, Semiconductors (Materials), Electrodes, Errors, Gates (Closures)