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Heat Transfer in Electronic Devices and Information Technology
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Proceedings Papers
Effect of Design Variables on Voids and Thermal Performance of QFN Packages
Available to Purchase
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 705-712, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32067
Proceedings Papers
Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment
Available to Purchase
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 713-718, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32100
Proceedings Papers
Numerical Solution Methodology for Compact Thermal Models of Electronic Packages
Available to Purchase
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 719-726, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32139
Proceedings Papers
Robust Thermal Design for Power Device Package Using Response Surface Method and Monte Carlo Simulation
Available to Purchase
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 727-732, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32168
Proceedings Papers
Evaluation of Condenser Transient Heat Transfer Behavior of the Small Scale Capillary-Pumped Loop
Available to Purchase
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 733-737, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32320
Proceedings Papers
Optimal Design of Coldplates for CPU Coolers
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Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 739-745, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32376
Proceedings Papers
The Effect of Nozzle Geometry on Pressure Drop and Heat Transfer to Free Surface Liquid Jet Arrays
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Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 747-756, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32384
Proceedings Papers
Effects of Clearance Between Heating Walls on Natural Cooling in a Channel Model of Electronic Equipment
Available to Purchase
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 757-762, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32723
Proceedings Papers
Heat Transport Characteristics of a Pulsating Heat Pipe
Available to Purchase
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 763-770, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32731
Proceedings Papers
Electro-Thermal Analysis of Submicron Si MOSFET With Zoned Mesh Based on Semiconductor Physics Theory
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Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 771-778, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32745