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Proceedings Papers

Evaporation of Silver-Graphene Hybrid Nanofluid Droplet on its Nanostructured Residue and Plain Copper Surfaces at Elevated Temperatures

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Farooq Riaz Siddiqui, Chi Yan Tso, Sau Chung Fu, Huihe Qiu, Christopher Yu Hang Chao
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T15A004, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-8922
https://doi.org/10.1115/HT2020-8922
View Paper titled, Evaporation of Silver-Graphene Hybrid Nanofluid Droplet on its Nanostructured Residue and Plain Copper Surfaces at Elevated Temperatures
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Topics: Copper, Drops, Evaporation, Graphene, Nanofluids, Silver, Temperature
Proceedings Papers

Nanoscale Thermal Radiation Between Coated Spheres

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Braden Czapla, Arvind Narayanaswamy
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T13A004, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4852
https://doi.org/10.1115/HT2017-4852
View Paper titled, Nanoscale Thermal Radiation Between Coated Spheres
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Topics: Coatings, Electrical conductance, Nanoscale phenomena, Phonons, Polaritons, Radiative heat transfer, Reflectance, Silver, Thermal radiation
Proceedings Papers

Laser Induced Implantation Doping of Glass Substrates

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Sepehr Sadeh, Kunal Mitra
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A007, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7402
https://doi.org/10.1115/HT2016-7402
View Paper titled, Laser Induced Implantation Doping of Glass Substrates
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Topics: Glass, Lasers, Catalysts, Fluence (Radiation measurement), Temperature, Transparency, Heat, Materials processing, Metals, Q-switching
Proceedings Papers

Enhanced Thermal Conductivity of Ethylene Glycol-Based Suspensions in the Presence of Silver Nanoparticles of Various Sizes and Shapes

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Xin Fang, Qing Ding, Li-Wu Fan, Zi-Tao Yu, Xu Xu, Guan-Hua Cheng, Ya-Cai Hu, Ke-Fa Cen
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T02A001, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17175
https://doi.org/10.1115/HT2013-17175
View Paper titled, Enhanced Thermal Conductivity of Ethylene Glycol-Based Suspensions in the Presence of Silver Nanoparticles of Various Sizes and Shapes
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Topics: Nanoparticles, Shapes, Silver, Thermal conductivity, Temperature, Disks, Fluids, Heat conduction, Heat transfer, Microscopy
Proceedings Papers

Film Boiling Around a Vertical Cylinder With Top and Bottom Horizontal Surfaces

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Satoru Momoki, Takashi Yamada, Toru Shigechi, Kuniyasu Kanemaru, Tomohiko Yamaguchi
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 611-619, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32733
https://doi.org/10.1115/HT2007-32733
View Paper titled, Film Boiling Around a Vertical Cylinder With Top and Bottom Horizontal Surfaces
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Topics: Cylinders, Film boiling, Subcooling, Water, Cooling, Heat transfer, Silver, Wall temperature, Atmospheric pressure, Convection
Proceedings Papers

Modeling Optical Properties of Small Metallic Nanoparticles Based on Density Functional Theory

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Yi He, Taofang Zeng
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 933-935, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32843
https://doi.org/10.1115/HT2007-32843
View Paper titled, Modeling Optical Properties of Small Metallic Nanoparticles Based on Density Functional Theory
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Topics: Density functional theory, Modeling, Nanoparticles, Silver, Atoms, Density, Electric fields, Electron configuration, Electrons, Tight-binding model
Proceedings Papers

Characterization of Interdigital Capacitive Strain Gauges by Direct Write Technology

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Jinggao Li, Jon P. Longtin, Szymon Tankiewicz, Andrew Gouldstone, Sanjay Sampath
Proc. ASME. HT2005, Heat Transfer: Volume 3, 237-243, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72769
https://doi.org/10.1115/HT2005-72769
View Paper titled, Characterization of Interdigital Capacitive Strain Gauges by Direct Write Technology
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Topics: Strain gages, Coatings, Gages, Lasers, Capacitance, Temperature, Computers, Copper, Glass reinforced plastics, High temperature
Proceedings Papers

Performance Analysis of an Ultrahigh Performance, 3-D Micro Convective Heat Sink With a Nearly Fractal Plumbing System

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R. Moreno, Y.-X. Tao
Proc. ASME. HT-FED2004, Volume 4, 293-301, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56076
https://doi.org/10.1115/HT-FED2004-56076
View Paper titled, Performance Analysis of an Ultrahigh Performance, 3-D Micro Convective Heat Sink With a Nearly Fractal Plumbing System
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Topics: Fractals, Heat sinks, Plumbing, Design, Computational fluid dynamics, Geometry, Ceramics, Computer software, Fluid dynamics, Heat transfer
Proceedings Papers

An Investigation of Copper Dissolution and the Formation of Intermetallic Compounds in Molten Tin and Tin-Silver Solders

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M. Faizan, R. A. McCoy, D. C. Lin, T. S. Srivatsan, G.-X. Wang
Proc. ASME. HT2003, Heat Transfer: Volume 3, 289-294, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47477
https://doi.org/10.1115/HT2003-47477
View Paper titled, An Investigation of Copper Dissolution and the Formation of Intermetallic Compounds in Molten Tin and Tin-Silver Solders
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Topics: Copper, Intermetallic compounds, Silver, Solders, Tin