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Proceedings Papers

Thermal Management of SOI-Based Devices Using Holey Silicon-Based Lateral Thermoelectric Cooler

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Jiajian Luo, Jingjing Chen, Archana Venugopal, Jaeho Lee
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T11A002, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-122922
https://doi.org/10.1115/HT2024-122922
View Paper titled, Thermal Management of SOI-Based Devices Using Holey Silicon-Based Lateral Thermoelectric Cooler
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Topics: Silicon, Silicon-on-insulator, Thermal management, Thermoelectric coolers, Transistors
Proceedings Papers

Simulation of Time-Domain Thermo-Reflectance Experiments Using the Anisotropic Fourier Heat Conduction Equation and the Phonon Boltzmann Transport Equation

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Siddharth Saurav, Sandip Mazumder
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T04A002, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131125
https://doi.org/10.1115/HT2024-131125
View Paper titled, Simulation of Time-Domain Thermo-Reflectance Experiments Using the Anisotropic Fourier Heat Conduction Equation and the Phonon Boltzmann Transport Equation
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Topics: Anisotropy, Heat conduction, Phonons, Simulation, Thermoreflectance, Thermal conductivity, Lasers, Temperature, Aluminum, Polarization (Electricity)
Proceedings Papers

Thermal Conductivity Extraction From Frequency Domain Thermo-Reflectance Experiments Using the Phonon Boltzmann Transport Equation

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Siddharth Saurav, Sandip Mazumder
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T02A003, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-106992
https://doi.org/10.1115/HT2023-106992
View Paper titled, Thermal Conductivity Extraction From Frequency Domain Thermo-Reflectance Experiments Using the Phonon Boltzmann Transport Equation
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Topics: Phonons, Thermal conductivity, Thermoreflectance, Pumps, Relaxation (Physics), Fittings, Heat conduction, Lasers, Probes, Signals
Proceedings Papers

A Comparative Study of 1-D and 3-D Simulation Methodologies To Predict the Thermal Performance of a Power Electronics Hardware

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Ankit Tiwari, Craig Whitaker, Brian Kendall
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T06A001, June 16–18, 2021
Publisher: American Society of Mechanical Engineers
Paper No: HT2021-62306
https://doi.org/10.1115/HT2021-62306
View Paper titled, A Comparative Study of 1-D and 3-D Simulation Methodologies To Predict the Thermal Performance of a Power Electronics Hardware
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Topics: Computational fluid dynamics, Electronics, Hardware, Heat transfer, Simulation, Radiation (Physics), Thermal analysis, Convection, Heat sinks, Temperature
Proceedings Papers

CFD Modeling of Thermal Management Systems for a Silicon Semiconductor Switch

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Jordan N. Berg, Sarvenaz Sobhansarbandi
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T09A011, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-9060
https://doi.org/10.1115/HT2020-9060
View Paper titled, CFD Modeling of Thermal Management Systems for a Silicon Semiconductor Switch
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Topics: Computational fluid dynamics, Microchannels, Modeling, Semiconductors (Materials), Silicon, Switches, Thermal management
Proceedings Papers

Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments

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Siddharth Saurav, Sandip Mazumder
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T15A001, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-8920
https://doi.org/10.1115/HT2020-8920
View Paper titled, Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments
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Topics: Thermal conductivity, Thermoreflectance, Heat conduction, Boundary-value problems, Transducers, Cooling, Electrical conductance, Heat, Lasers, Pumps
Proceedings Papers

Heat Transfer Coefficient of a Graphite Mold Quenched by Water

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Yi Pan, Jeffrey Thomas, Chris Propes
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T15A003, July 14–17, 2019
Publisher: American Society of Mechanical Engineers
Paper No: HT2019-3731
https://doi.org/10.1115/HT2019-3731
View Paper titled, Heat Transfer Coefficient of a Graphite Mold Quenched by Water
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Topics: Graphite, Heat transfer coefficients, Water, Flow (Dynamics), Heat flux, Quenching (Metalworking), Temperature, Metal matrix composites, Alloys, Aluminum
Proceedings Papers

Enhanced Coherent Thermal Emission From SiO 2 on a Porous Silicon Photonic Crystal

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Alexandre Juneau-Fecteau, Ali Belarouci, Luc G. Fréchette
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T14A012, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4891
https://doi.org/10.1115/HT2017-4891
View Paper titled, Enhanced Coherent Thermal Emission From SiO 2 on a Porous Silicon Photonic Crystal
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Topics: Crystals, Emissions, Silicon, Plasma-enhanced chemical vapor deposition, Reflectance, Computation, Current density, Electromagnetic spectrum, Emissivity, Engineering simulation
Proceedings Papers

Flow Patterns During Flow Boiling Instability in Silicon-Based Pin-Fin Microchannels

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Fayao Xu, Huiying Wu, Zhenyu Liu
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A003, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7387
https://doi.org/10.1115/HT2016-7387
View Paper titled, Flow Patterns During Flow Boiling Instability in Silicon-Based Pin-Fin Microchannels
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Topics: Boiling, Flow (Dynamics), Microchannels, Silicon, Oscillations, Vapors, Temperature, Temperature measurement, Two-phase flow, Bubbly flow
Proceedings Papers

A Novel Machine-Learning Aided Optimization Technique for Material Design: Application in Thin Film Solar Cells

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Shima Hajimirza
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T15A016, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7306
https://doi.org/10.1115/HT2016-7306
View Paper titled, A Novel Machine-Learning Aided Optimization Technique for Material Design: Application in Thin Film Solar Cells
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Topics: Design, Machine learning, Optimization, Solar cells, Thin films, Algorithms, Absorption, Energy conversion, Engineering systems and industry applications, Light
Proceedings Papers

Hybrid Ballistic-Diffusive Solution of the Frequency-Dependent Phonon Boltzmann Transport Equation

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Pareekshith Allu, Sandip Mazumder
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T15A012, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7079
https://doi.org/10.1115/HT2016-7079
View Paper titled, Hybrid Ballistic-Diffusive Solution of the Frequency-Dependent Phonon Boltzmann Transport Equation
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Topics: Phonons, Knudsen number, Partial differential equations, Anisotropy, Heat conduction, Nanoscale phenomena, Resolution (Optics), Silicon, Steady state, Transients (Dynamics)
Proceedings Papers

Multi-Objective Design Optimization of Multi-Floor, Counterflow Micro Heat Exchangers

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Abas Abdoli, George S. Dulikravich
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A001, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17738
https://doi.org/10.1115/HT2013-17738
View Paper titled, Multi-Objective Design Optimization of Multi-Floor, Counterflow Micro Heat Exchangers
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Topics: Design, Heat exchangers, Optimization, Microchannels, Flow (Dynamics), Heat, Cooling, Pareto optimization, Pressure drop, Temperature nonunifomity
Proceedings Papers

Investigation of Microboiler for Discarded Thermal Scavenging

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S. Thapa, J. Fang, D. Wood, L. Weiss
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A013, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17069
https://doi.org/10.1115/HT2013-17069
View Paper titled, Investigation of Microboiler for Discarded Thermal Scavenging
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Topics: Absorption, Boilers, Capillarity, Design, Flow (Dynamics), Fluids, Manufacturing, Mass transfer, Membranes, Microelectromechanical systems
Proceedings Papers

Computational Evaluation of the Effects of Voids on a Thermal Energy Storage System Using Molten Silicon as the Phase Change Material

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Thomas R. Amundson, David B. Scharfe, Rebecca N. Webb
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T01A042, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17216
https://doi.org/10.1115/HT2013-17216
View Paper titled, Computational Evaluation of the Effects of Voids on a Thermal Energy Storage System Using Molten Silicon as the Phase Change Material
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Topics: Latent heat, Phase change materials, Silicon, Thermal energy storage
Proceedings Papers

Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction

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Hua Bao, Shirui Luo, Ming Hu
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A039, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17176
https://doi.org/10.1115/HT2013-17176
View Paper titled, Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction
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Topics: Carbon, Graphene, Junctions, Nanotubes, Carbon nanotubes, Energy dissipation, Heat, Silicon, Thermal conductivity, Engineering systems and industry applications
Proceedings Papers

Design and Verification of a PECVD Fabricated Multi-Layer Nano-Scale Photovoltaic Device

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Shima Hajimirza, John R. Howell, Milo Holt, Sayan Saha, Deji Akinwande, Sanjay Banerjee
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T01A003, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17271
https://doi.org/10.1115/HT2013-17271
View Paper titled, Design and Verification of a PECVD Fabricated Multi-Layer Nano-Scale Photovoltaic Device
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Topics: Design, Nanoscale phenomena, Plasma-enhanced chemical vapor deposition, Silicon, Spectra (Spectroscopy), Thin films, Engineering simulation, Errors, Reflectance, Simulation
Proceedings Papers

In Situ Particle Size Measurements of Gas-Borne Silicon Nanoparticles by Time-Resolved Laser-Induced Incandescence

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T. A. Sipkens, N. Petermann, K. J. Daun, J. Titantah, M. Karttunen, H. Wiggers, T. Dreier, C. Schulz
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A001, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17246
https://doi.org/10.1115/HT2013-17246
View Paper titled, In Situ Particle Size Measurements of Gas-Borne Silicon Nanoparticles by Time-Resolved Laser-Induced Incandescence
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Topics: Lasers, Light emission, Nanoparticles, Particle size, Silicon, Tires, Combustion, Helium, Molecular dynamics, Plasmas (Ionized gases)
Proceedings Papers

Tuning Near Field Radiation by Doped Silicon

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Jiawei Shi, Sheng Shen
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A002, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17092
https://doi.org/10.1115/HT2013-17092
View Paper titled, Tuning Near Field Radiation by Doped Silicon
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Topics: Radiation (Physics), Silicon, Electrical conductance, Nanoscale phenomena
Proceedings Papers

Self-Organized Micro-Honeycomb Network Structure of Single-Walled Carbon Nanotubes for Photovoltaic Devices

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Shigeo Maruyama, Kehang Cui, Takaaki Chiba, Erik Einarsson, Shohei Chiashi
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A043, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17304
https://doi.org/10.1115/HT2013-17304
View Paper titled, Self-Organized Micro-Honeycomb Network Structure of Single-Walled Carbon Nanotubes for Photovoltaic Devices
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Topics: Honeycomb structures, Single-walled carbon nanotubes, Single-walled nanotubes, Solar cells, Circuits, Water vapor, Drying, Electrodes, Manufacturing, Nanomaterials
Proceedings Papers

Dependence of Thermal Conductivities of the AlN Film in the LED Architecture on Surface Roughness and Lattice Mismatch

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Zonghui Su, Jonathan A. Malen, Justin P. Freedman, Robert F. Davis, Jacob H. Leach, Edward A. Preble
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A004, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17116
https://doi.org/10.1115/HT2013-17116
View Paper titled, Dependence of Thermal Conductivities of the AlN Film in the LED Architecture on Surface Roughness and Lattice Mismatch
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Topics: Surface roughness, Aluminum, Crystals, Interfacial thermal resistance, Resolution (Optics), Sapphire, Silicon, Thermal conductivity, Thermal resistance, Thin films