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Proceedings Papers

Thermal Energy Transport Below the Diffraction Limit in Close-Packed Metal Nanoparticles

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Anil Yuksel, Michael Cullinan, Jayathi Murthy
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T13A005, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4968
https://doi.org/10.1115/HT2017-4968
View Paper titled, Thermal Energy Transport Below the Diffraction Limit in Close-Packed Metal Nanoparticles
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Topics: Diffraction, Metals, Nanoparticles, Thermal energy transport, Packings (Cushioning), Manufacturing, Absorption, Copper, Electromagnetic scattering, Additive manufacturing
Proceedings Papers

3D Thermal Resistance Network Method for the Design of Highly Integrated Packages

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Lauren Boteler, Andrew Smith
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A009, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17575
https://doi.org/10.1115/HT2013-17575
View Paper titled, 3D Thermal Resistance Network Method for the Design of Highly Integrated Packages
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Topics: Design, Thermal resistance, Packaging, Resistors, Temperature, Cooling, Dimensions, Electronics, Computer simulation, Energy dissipation
Proceedings Papers

The Performance of Methanol and Water Heat Pipes for Electronics Cooling Applications in Spacecraft Instrumentation

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John D. Bernardin
Proc. ASME. HT2005, Heat Transfer: Volume 4, 669-679, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72057
https://doi.org/10.1115/HT2005-72057
View Paper titled, The Performance of Methanol and Water Heat Pipes for Electronics Cooling Applications in Spacecraft Instrumentation
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Topics: Computer cooling, Heat pipes, Instrumentation, Methanol, Space vehicles, Water, Heat, Copper, Electronics, Contamination
Proceedings Papers

The Response of Portable Electronics to Transient Conditions of Temperature and Humidity

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Jeff Punch, Ronan Grimes, Greg Heaslip, Timo Galkin, Kyo¨sti Va¨keva¨inen, Vesa Kyyhkynen, Erkko Elonen
Proc. ASME. HT2005, Heat Transfer: Volume 4, 871-876, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72578
https://doi.org/10.1115/HT2005-72578
View Paper titled, The Response of Portable Electronics to Transient Conditions of Temperature and Humidity
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Topics: Electronics, Temperature, Transients (Dynamics), Condensation, Corrosion, Design, Electronic systems, Electronic products, Engineers, Experimental characterization
Proceedings Papers

Thermal Management of Heat Generating Devices in Close Proximity on Printed Circuit Boards

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Jared Harvest, Amy S. Fleischer, Randy D. Weinstein
Proc. ASME. HT2005, Heat Transfer: Volume 4, 599-605, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72254
https://doi.org/10.1115/HT2005-72254
View Paper titled, Thermal Management of Heat Generating Devices in Close Proximity on Printed Circuit Boards
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Topics: Heat, Printed circuit boards, Thermal management, Separation (Technology), Computational fluid dynamics, Density, Experimental design, Geometry, Maintenance, Natural convection
Proceedings Papers

Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling

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Xuejiao Hu, Ravi Prasher, Kenneth Goodson
Proc. ASME. HT2005, Heat Transfer: Volume 4, 963-966, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72729
https://doi.org/10.1115/HT2005-72729
View Paper titled, Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling
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Topics: Computer cooling, Heat conduction, Packaging, Composite materials, Polymers, Semiconductors (Materials), Thermal resistance, Thin films
Proceedings Papers

Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging

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Marios Alaeddine, Jin Zou, Rajesh Ranganathan, Charalabos C. Doumanidis, Teiichi Ando, Peter Y. Wong
Proc. ASME. HT-FED2004, Volume 3, 869-875, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56116
https://doi.org/10.1115/HT-FED2004-56116
View Paper titled, Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging
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Topics: Lasers, MEMS packaging, Modeling, Sealing (Process), Temperature, Heat, Intermetallic compounds, Microelectromechanical systems, Heating, Melting
Proceedings Papers

Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm

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Hamid A. Hadim, Tohru Suwa
Proc. ASME. HT-FED2004, Volume 4, 495-502, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56512
https://doi.org/10.1115/HT-FED2004-56512
View Paper titled, Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm
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Topics: Ball-Grid-Array packages, Design, Genetic algorithms, Optimization, Thermomechanics, Ball-Grid-Array packaging, Electronic packages, Electronic packaging, Electronics, Leakage
Proceedings Papers

A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design

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Hamid Hadim, Tohru Suwa
Proc. ASME. HT2003, Heat Transfer: Volume 3, 557-564, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47524
https://doi.org/10.1115/HT2003-47524
View Paper titled, A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design
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Topics: Ball-Grid-Array packaging, Design, Electronic packaging, Optimization, Artificial neural networks, Electronic products, Engineering disciplines, Leakage, Packaging, Tradeoffs