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Proceedings Papers
Thermal Energy Transport Below the Diffraction Limit in Close-Packed Metal Nanoparticles
Available to Purchase
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T13A005, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4968
Proceedings Papers
3D Thermal Resistance Network Method for the Design of Highly Integrated Packages
Available to Purchase
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A009, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17575
Proceedings Papers
The Performance of Methanol and Water Heat Pipes for Electronics Cooling Applications in Spacecraft Instrumentation
Available to Purchase
Proc. ASME. HT2005, Heat Transfer: Volume 4, 669-679, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72057
Proceedings Papers
The Response of Portable Electronics to Transient Conditions of Temperature and Humidity
Available to PurchaseJeff Punch, Ronan Grimes, Greg Heaslip, Timo Galkin, Kyo¨sti Va¨keva¨inen, Vesa Kyyhkynen, Erkko Elonen
Proc. ASME. HT2005, Heat Transfer: Volume 4, 871-876, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72578
Proceedings Papers
Thermal Management of Heat Generating Devices in Close Proximity on Printed Circuit Boards
Available to Purchase
Proc. ASME. HT2005, Heat Transfer: Volume 4, 599-605, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72254
Proceedings Papers
Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling
Available to Purchase
Proc. ASME. HT2005, Heat Transfer: Volume 4, 963-966, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72729
Proceedings Papers
Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging
Available to PurchaseMarios Alaeddine, Jin Zou, Rajesh Ranganathan, Charalabos C. Doumanidis, Teiichi Ando, Peter Y. Wong
Proc. ASME. HT-FED2004, Volume 3, 869-875, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56116
Proceedings Papers
Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm
Available to Purchase
Proc. ASME. HT-FED2004, Volume 4, 495-502, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56512
Proceedings Papers
A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design
Available to Purchase
Proc. ASME. HT2003, Heat Transfer: Volume 3, 557-564, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47524