1-15 of 15
Microelectronic devices
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Reducing Crossflow Effects in Arrays of Impinging Jets

Nicholas R. Arens, Mitchell P. Morem, Jeffrey Doom, Gregory J. Michna
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A007, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4849
https://doi.org/10.1115/HT2017-4849
View Paper titled, Reducing Crossflow Effects in Arrays of Impinging Jets
Open the PDF for Reducing Crossflow Effects in Arrays of Impinging Jets in another window
Topics: Jets, Heat transfer, Nozzles, Computational fluid dynamics, Flow (Dynamics), Fluids, Microelectronic devices, Simulation, Thermal management, Additive manufacturing
Proceedings Papers

First-Order Model of Free-Jet Hydrodynamic Evolution for Heat Transfer Prediction, Including Nozzle and Flow Rate Effects

Ron S. Harnik, Herman D. Haustein
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T05A008, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7388
https://doi.org/10.1115/HT2016-7388
View Paper titled, First-Order Model of Free-Jet Hydrodynamic Evolution for Heat Transfer Prediction, Including Nozzle and Flow Rate Effects
Open the PDF for First-Order Model of Free-Jet Hydrodynamic Evolution for Heat Transfer Prediction, Including Nozzle and Flow Rate Effects in another window
Topics: Flow (Dynamics), Heat transfer, Nozzles, Flight, Pipes, Cooling, Jets, Laminar flow, Surface tension, Approximation
Proceedings Papers

Exploring Augmentation of Thermal-Fluid Transport in Fractal Architectures

Surupa Shaw, Debjyoti Banerjee
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T03A008, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7492
https://doi.org/10.1115/HT2016-7492
View Paper titled, Exploring Augmentation of Thermal-Fluid Transport in Fractal Architectures
Open the PDF for Exploring Augmentation of Thermal-Fluid Transport in Fractal Architectures in another window
Topics: Architecture, Fractals, Thermofluids, Heat, Heat transfer, Energy dissipation, Flux (Metallurgy), Appropriate technology, Cooling systems, Energy consumption
Proceedings Papers

Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction

Hua Bao, Shirui Luo, Ming Hu
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A039, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17176
https://doi.org/10.1115/HT2013-17176
View Paper titled, Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction
Open the PDF for Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction in another window
Topics: Carbon, Graphene, Junctions, Nanotubes, Carbon nanotubes, Energy dissipation, Heat, Silicon, Thermal conductivity, Engineering systems and industry applications
Proceedings Papers

Numerical Evaluation of 2D and 3D Steady and Unsteady Flows of a Pair of Opposing Confined Impinging Air Jets

Victor Chiriac, Jorge L. Rosales
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 495-502, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88303
https://doi.org/10.1115/HT2009-88303
View Paper titled, Numerical Evaluation of 2D and 3D Steady and Unsteady Flows of a Pair of Opposing Confined Impinging Air Jets
Open the PDF for Numerical Evaluation of 2D and 3D Steady and Unsteady Flows of a Pair of Opposing Confined Impinging Air Jets in another window
Topics: Air jets, Cooling, Jets, Unsteady flow, Flow (Dynamics), Reynolds number, Heat transfer, Vortices, Buckling, Convection
Proceedings Papers

The Enhancement Ratio of Corresponding Convection Heat Transfer Coefficient Using Electrospray Evaporative Cooling System

H. C. Wang, C. P. Hsu, A. V. Mamishev
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 1013-1020, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88629
https://doi.org/10.1115/HT2009-88629
View Paper titled, The Enhancement Ratio of Corresponding Convection Heat Transfer Coefficient Using Electrospray Evaporative Cooling System
Open the PDF for The Enhancement Ratio of Corresponding Convection Heat Transfer Coefficient Using Electrospray Evaporative Cooling System in another window
Topics: Convection, Evaporative cooling, Nozzles, Cooling, Heat, Heat flux, Heat transfer, Plasma spraying, Spraying (Coating processes), Ethanol
Proceedings Papers

Nanoscale Wicking Structures

Conan Zhang, Carlos H. Hidrovo
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 941-954, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88416
https://doi.org/10.1115/HT2009-88416
View Paper titled, Nanoscale Wicking Structures
Open the PDF for Nanoscale Wicking Structures in another window
Topics: Condensers (steam plant), Coolants, Creeping flow, Dimensions, Energy dissipation, Flow (Dynamics), Fluid dynamics, Flux (Metallurgy), Geometry, Heat
Proceedings Papers

Experimental Measurement of Multiple Thermal Properties by Error Minimization

Brian Smith, Cristina Amon
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 283-291, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32190
https://doi.org/10.1115/HT2007-32190
View Paper titled, Experimental Measurement of Multiple Thermal Properties by Error Minimization
Open the PDF for Experimental Measurement of Multiple Thermal Properties by Error Minimization in another window
Topics: Errors, Fittings, Temperature measurement, Thermal properties, Thermoreflectance, Thin films, Polymer films, Actuators, Algorithms, Approximation
Proceedings Papers

Infrared Quantum Dots for Liquid-Phase Thermometry in Silicon Microchannels

Myeongsub Kim, Minami Yoda
Proc. ASME. HT2008, Heat Transfer: Volume 1, 349-355, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56207
https://doi.org/10.1115/HT2008-56207
View Paper titled, Infrared Quantum Dots for Liquid-Phase Thermometry in Silicon Microchannels
Open the PDF for Infrared Quantum Dots for Liquid-Phase Thermometry in Silicon Microchannels in another window
Topics: Microchannels, Quantum dots, Silicon, Temperature measurement, Temperature, Emissions, Cooling, Visible spectrum, Wavelength, Absorption
Proceedings Papers

Thermal Conductivity Measurements of Si-SiO 2 -Si Sandwich Structures for Micro/Nano Electronics

Christina Royce, Mehmet Arik, Stanton Weaver, J. W. Bray, Victor Ovsyuk, Anatoly Klimenko, Andrey Yartsev
Proc. ASME. HT2008, Heat Transfer: Volume 2, 735-744, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56001
https://doi.org/10.1115/HT2008-56001
View Paper titled, Thermal Conductivity Measurements of Si-SiO 2 -Si Sandwich Structures for Micro/Nano Electronics
Open the PDF for Thermal Conductivity Measurements of Si-SiO 2 -Si Sandwich Structures for Micro/Nano Electronics in another window
Topics: Nanoelectronics, Sandwich structures, Thermal conductivity, Lasers, Thin films, Uncertainty, Silicon, Steady state, Thermocouples, Bonding
Proceedings Papers

Aerogel for Microsystems Thermal Insulation: System Design and Process Development

Brian Smith, David Romero, Damena Agonafer, Jason Gu, Cristina H. Amon
Proc. ASME. HT2005, Heat Transfer: Volume 4, 753-762, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72663
https://doi.org/10.1115/HT2005-72663
View Paper titled, Aerogel for Microsystems Thermal Insulation: System Design and Process Development
Open the PDF for Aerogel for Microsystems Thermal Insulation: System Design and Process Development in another window
Topics: Design, Microelectromechanical systems, Thermal insulation, Microelectronic devices, Crystals, Modeling, Sensors, Computer simulation, Electrical properties, Electronic systems
Proceedings Papers

Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling

Michael K. Patterson, Xiaojin Wei, Yogendra Joshi
Proc. ASME. HT2005, Heat Transfer: Volume 4, 453-459, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72647
https://doi.org/10.1115/HT2005-72647
View Paper titled, Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling
Open the PDF for Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling in another window
Topics: Computational fluid dynamics, Cooling, Design, Heat exchangers, Microchannels, Microelectronic devices, Optimization, Circuits, Convection, Cooling systems
Proceedings Papers

Thermal Transport Network Model for High-Porosity Materials: Application to Nanoporous Aerogels

Brian R. Smith, Peter D. Beutler, Cristina H. Amon
Proc. ASME. HT2005, Heat Transfer: Volume 4, 955-961, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72662
https://doi.org/10.1115/HT2005-72662
View Paper titled, Thermal Transport Network Model for High-Porosity Materials: Application to Nanoporous Aerogels
Open the PDF for Thermal Transport Network Model for High-Porosity Materials: Application to Nanoporous Aerogels in another window
Topics: Network models, Porosity, Thermal conductivity, Thermal properties, Heat, Manufacturing, Amorphous materials, Diffusion (Physics), Microelectromechanical systems, Microelectronic devices
Proceedings Papers

Optimum Number Density of Blocks Released in Fluidic Self-Assembly of Microelectronics

Adriana Brasoava, Radu Danescu, David Wells, Nayan Reddy
Proc. ASME. HT2005, Heat Transfer: Volume 3, 419-423, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72768
https://doi.org/10.1115/HT2005-72768
View Paper titled, Optimum Number Density of Blocks Released in Fluidic Self-Assembly of Microelectronics
Open the PDF for Optimum Number Density of Blocks Released in Fluidic Self-Assembly of Microelectronics in another window
Topics: Density, Microelectronic devices, Self-assembly, Mechanical admittance, Plates (structures), Shapes, Silicon, Water
Proceedings Papers

Constructal Theory of the Minimum Requirements for Forced Convection Cooling Solutions

E. J. Walsh, R. Grimes
Proc. ASME. HT2005, Heat Transfer: Volume 4, 711-713, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72416
https://doi.org/10.1115/HT2005-72416
View Paper titled, Constructal Theory of the Minimum Requirements for Forced Convection Cooling Solutions
Open the PDF for Constructal Theory of the Minimum Requirements for Forced Convection Cooling Solutions in another window
Topics: Cooling, Forced convection, Design, Microelectronic devices, Microfluidics, Microscale devices