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Proceedings Papers

Investigation of Microboiler for Discarded Thermal Scavenging

Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A013, July 14–19, 2013

Paper No: HT2013-17069

DOI: https://doi.org/10.1115/HT2013-17069

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Topics: Absorption, Boilers, Capillarity, Design, Flow (Dynamics), Fluids, Manufacturing, Mass transfer, Membranes, Microelectromechanical systems

Proceedings Papers

Conjugated Heat Transfer in Heat Spreaders With Micro-Channels

Diego C. Knupp, Renato M. Cotta, Carolina P. Naveira Cotta

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A007, July 14–19, 2013

Paper No: HT2013-17818

DOI: https://doi.org/10.1115/HT2013-17818

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Topics: Flat heat pipes, Heat transfer, Microchannels, Convection, Fluids, Microelectromechanical systems, Diffusion (Physics), Flow (Dynamics), Heat, Heat conduction

Proceedings Papers

Raman Thermometry and Thermal Modeling of Highly Doped Silicon-on-Insulator Joule Heated MEMS Bridges Under Varying Gas Pressures

Justin R. Serrano, Edward S. Piekos, Leslie M. Phinney

Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 525-531, July 8–12, 2012

Paper No: HT2012-58114

DOI: https://doi.org/10.1115/HT2012-58114

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Topics: Bridges (Structures), Joules, Microelectromechanical systems, Modeling, Silicon-on-insulator, Temperature measurement, Temperature, Simulation, Heat transfer, Pressure

Proceedings Papers

Numerical Modeling of a Micro-Scale Stirling Cooler

Dongzhi Guo, Alan J. H. McGaughey, Jinsheng Gao, Gary K. Fedder, Minyoung Lee, Shi-Chune Yao

Paper No: HT2012-58361

DOI: https://doi.org/10.1115/HT2012-58361

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Topics: Computer simulation, Microscale devices, Porous materials, Cooling, Columns (Structural), Geometry, Heat transfer, Porosity, Compressible flow, Coolers

Proceedings Papers

Heat Transfer Performance of SiO 2 -Water Nanofluid in a Plate Heat Exchanger

Anoop Kanjirakat, Reza Sadr

Paper No: HT2012-58291

DOI: https://doi.org/10.1115/HT2012-58291

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Topics: Heat exchangers, Heat transfer, Nanofluids, Water, Fluids, Pressure drop, Flow (Dynamics), Heat transfer coefficients, Particulate matter, Microelectromechanical systems

Proceedings Papers

Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 to 625 Torr

Leslie M. Phinney, Justin R. Serrano, Edward S. Piekos, John R. Torczynski, Michael A. Gallis, Allen D. Gorby

Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 389-398, July 19–23, 2009

Paper No: HT2009-88583

DOI: https://doi.org/10.1115/HT2009-88583

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Topics: Bridges (Structures), Engineering simulation, Microelectromechanical systems, Simulation, Temperature measurement, Pressure, Finite element analysis, Finite element model, Heat transfer, Materials properties

Proceedings Papers

An Opto-Thermal Micro-Disk Resonator for Temperature Detection

Anisur Rahman, Sunil Kumar

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 531-535, July 19–23, 2009

Paper No: HT2009-88572

DOI: https://doi.org/10.1115/HT2009-88572

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Topics: Disks, Temperature, Resonance, Sensors, Finite element analysis, Microelectromechanical systems, Simulation, Temperature sensors, Theoretical analysis, Wave propagation

Proceedings Papers

Experimental Measurement of Multiple Thermal Properties by Error Minimization

Brian Smith, Cristina Amon

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 283-291, July 8–12, 2007

Paper No: HT2007-32190

DOI: https://doi.org/10.1115/HT2007-32190

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Topics: Errors, Fittings, Temperature measurement, Thermal properties, Thermoreflectance, Thin films, Polymer films, Actuators, Algorithms, Approximation

Proceedings Papers

Optical Resonance in Dielectric Micro-Sphere for Temperature Measurement

Anisur Rahman, Sunil Kumar

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 303-312, July 8–12, 2007

Paper No: HT2007-32468

DOI: https://doi.org/10.1115/HT2007-32468

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Topics: Resonance, Temperature measurement, Wavelength, Microelectromechanical systems, Temperature, Waves, Biomedicine, Electromagnetic theory, Nanotechnology, Q-factor

Proceedings Papers

Convective Heat Transfer of Nanofluids (DI Water-Al 2 O 3 ) in Micro-Channels

Joohyun Lee, Roger D. Flynn, Kenneth E. Goodson, John K. Eaton

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 843-850, July 8–12, 2007

Paper No: HT2007-32630

DOI: https://doi.org/10.1115/HT2007-32630

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Topics: Convection, Microchannels, Nanofluids, Water, Microelectromechanical systems, Nanoparticles, Stainless steel, Thermal conductivity, Boundary-value problems, Dynamic light scattering

Proceedings Papers

Aerogel for Microsystems Thermal Insulation: System Design and Process Development

Brian Smith, David Romero, Damena Agonafer, Jason Gu, Cristina H. Amon

Proc. ASME. HT2005, Heat Transfer: Volume 4, 753-762, July 17–22, 2005

Paper No: HT2005-72663

DOI: https://doi.org/10.1115/HT2005-72663

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Topics: Design, Microelectromechanical systems, Thermal insulation, Microelectronic devices, Crystals, Modeling, Sensors, Computer simulation, Electrical properties, Electronic systems

Proceedings Papers

Effect of Conjugate Heat Transfer on MEMS-Based Thermal Shear Stress Sensor

Jianghui Chao, Wei Shyy, Siddharth S. Thakur, Mark Sheplak, Renwei Mei

Proc. ASME. HT2005, Heat Transfer: Volume 4, 773-788, July 17–22, 2005

Paper No: HT2005-72054

DOI: https://doi.org/10.1115/HT2005-72054

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Topics: Heat transfer, Microelectromechanical systems, Sensors, Shear stress

Proceedings Papers

Thermal Transport Network Model for High-Porosity Materials: Application to Nanoporous Aerogels

Brian R. Smith, Peter D. Beutler, Cristina H. Amon

Proc. ASME. HT2005, Heat Transfer: Volume 4, 955-961, July 17–22, 2005

Paper No: HT2005-72662

DOI: https://doi.org/10.1115/HT2005-72662

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Topics: Network models, Porosity, Thermal conductivity, Thermal properties, Heat, Manufacturing, Amorphous materials, Diffusion (Physics), Microelectromechanical systems, Microelectronic devices

Proceedings Papers

Independent Hybrid Power Plant “PEMFC+MEMS” With Use of Molecular Ceramic Membranes to Separate CO and H2

A. V. Soudarev, A. A. Souryaninov, V. G. Konakov, A. S. Molchanov

Proc. ASME. HT2005, Heat Transfer: Volume 3, 29-36, July 17–22, 2005

Paper No: HT2005-72243

DOI: https://doi.org/10.1115/HT2005-72243

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Topics: Ceramics, Hybrid power systems, Membranes, Proton exchange membrane fuel cells, Coordinate measuring machines, Hybrid engines, Hydrogen, Microelectromechanical systems, Temperature, Catalysts

Proceedings Papers

Laser Surface Texturing: Applications and Research Opportunities

David A. Willis

Proc. ASME. HT2005, Heat Transfer: Volume 3, 311-313, July 17–22, 2005

Paper No: HT2005-72676

DOI: https://doi.org/10.1115/HT2005-72676

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Topics: Lasers, Drops, Melting, Semiconductor wafers, Density, Displacement, Fluence (Radiation measurement), Metallic films, Metals, Microelectromechanical systems

Proceedings Papers

Experiment of Micro Cantilever Deflection by Thermal Bubble Growth in Liquid

Heon J. Lee, Young-Soo Chang, Ho-Young Kim, Jong-Seob Ahn, Yoon-Pyo Lee

Proc. ASME. HT2005, Heat Transfer: Volume 2, 487-489, July 17–22, 2005

Paper No: HT2005-72486

DOI: https://doi.org/10.1115/HT2005-72486

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Topics: Bubbles, Deflection, Microcantilevers, Microelectromechanical systems, Atomic force microscopy, Cantilever beams, Cantilevers, Dry etching, Geometry, Manufacturing

Proceedings Papers

Infrared Micro-Particle Image Velocimetry of Fluid Flow in Silicon-Based Microdevices

Dong Liu, Suresh V. Garimella, Steve T. Wereley

Proc. ASME. HT-FED2004, Volume 4, 399-405, July 11–15, 2004

Paper No: HT-FED2004-56385

DOI: https://doi.org/10.1115/HT-FED2004-56385

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Topics: Fluid dynamics, Microparticles, Silicon, Flow measurement, Algorithms, Biomedicine, Computer cooling, Flow (Dynamics), Laminar flow, Light

Proceedings Papers

Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging

Marios Alaeddine, Jin Zou, Rajesh Ranganathan, Charalabos C. Doumanidis, Teiichi Ando, Peter Y. Wong

Proc. ASME. HT-FED2004, Volume 3, 869-875, July 11–15, 2004

Paper No: HT-FED2004-56116

DOI: https://doi.org/10.1115/HT-FED2004-56116

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Topics: Lasers, MEMS packaging, Modeling, Sealing (Process), Temperature, Heat, Intermetallic compounds, Microelectromechanical systems, Heating, Melting

NARROW

Investigation of Microboiler for Discarded Thermal Scavenging

Conjugated Heat Transfer in Heat Spreaders With Micro-Channels

Raman Thermometry and Thermal Modeling of Highly Doped Silicon-on-Insulator Joule Heated MEMS Bridges Under Varying Gas Pressures

Numerical Modeling of a Micro-Scale Stirling Cooler

Heat Transfer Performance of SiO 2 -Water Nanofluid in a Plate Heat Exchanger

Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 to 625 Torr

An Opto-Thermal Micro-Disk Resonator for Temperature Detection

Experimental Measurement of Multiple Thermal Properties by Error Minimization

Optical Resonance in Dielectric Micro-Sphere for Temperature Measurement

Convective Heat Transfer of Nanofluids (DI Water-Al 2 O 3 ) in Micro-Channels

Aerogel for Microsystems Thermal Insulation: System Design and Process Development

Effect of Conjugate Heat Transfer on MEMS-Based Thermal Shear Stress Sensor

Thermal Transport Network Model for High-Porosity Materials: Application to Nanoporous Aerogels

Independent Hybrid Power Plant “PEMFC+MEMS” With Use of Molecular Ceramic Membranes to Separate CO and H2

Laser Surface Texturing: Applications and Research Opportunities

Experiment of Micro Cantilever Deflection by Thermal Bubble Growth in Liquid

Infrared Micro-Particle Image Velocimetry of Fluid Flow in Silicon-Based Microdevices

Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging

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