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Proceedings Papers

Investigation of Microboiler for Discarded Thermal Scavenging

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S. Thapa, J. Fang, D. Wood, L. Weiss
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A013, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17069
https://doi.org/10.1115/HT2013-17069
View Paper titled, Investigation of Microboiler for Discarded Thermal Scavenging
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Topics: Absorption, Boilers, Capillarity, Design, Flow (Dynamics), Fluids, Manufacturing, Mass transfer, Membranes, Microelectromechanical systems
Proceedings Papers

Conjugated Heat Transfer in Heat Spreaders With Micro-Channels

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Diego C. Knupp, Renato M. Cotta, Carolina P. Naveira Cotta
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A007, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17818
https://doi.org/10.1115/HT2013-17818
View Paper titled, Conjugated Heat Transfer in Heat Spreaders With Micro-Channels
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Topics: Flat heat pipes, Heat transfer, Microchannels, Convection, Fluids, Microelectromechanical systems, Diffusion (Physics), Flow (Dynamics), Heat, Heat conduction
Proceedings Papers

Numerical Modeling of a Micro-Scale Stirling Cooler

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Dongzhi Guo, Alan J. H. McGaughey, Jinsheng Gao, Gary K. Fedder, Minyoung Lee, Shi-Chune Yao
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 331-337, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58361
https://doi.org/10.1115/HT2012-58361
View Paper titled, Numerical Modeling of a Micro-Scale Stirling Cooler
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Topics: Computer simulation, Microscale devices, Porous materials, Cooling, Columns (Structural), Geometry, Heat transfer, Porosity, Compressible flow, Coolers
Proceedings Papers

Heat Transfer Performance of SiO 2 -Water Nanofluid in a Plate Heat Exchanger

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Anoop Kanjirakat, Reza Sadr
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 267-272, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58291
https://doi.org/10.1115/HT2012-58291
View Paper titled, Heat Transfer Performance of SiO 2 -Water Nanofluid in a Plate Heat Exchanger
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Topics: Heat exchangers, Heat transfer, Nanofluids, Water, Fluids, Pressure drop, Flow (Dynamics), Heat transfer coefficients, Particulate matter, Microelectromechanical systems
Proceedings Papers

Raman Thermometry and Thermal Modeling of Highly Doped Silicon-on-Insulator Joule Heated MEMS Bridges Under Varying Gas Pressures

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Justin R. Serrano, Edward S. Piekos, Leslie M. Phinney
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 525-531, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58114
https://doi.org/10.1115/HT2012-58114
View Paper titled, Raman Thermometry and Thermal Modeling of Highly Doped Silicon-on-Insulator Joule Heated MEMS Bridges Under Varying Gas Pressures
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Topics: Bridges (Structures), Joules, Microelectromechanical systems, Modeling, Silicon-on-insulator, Temperature measurement, Temperature, Simulation, Heat transfer, Pressure
Proceedings Papers

Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 to 625 Torr

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Leslie M. Phinney, Justin R. Serrano, Edward S. Piekos, John R. Torczynski, Michael A. Gallis, Allen D. Gorby
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 389-398, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88583
https://doi.org/10.1115/HT2009-88583
View Paper titled, Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 to 625 Torr
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Topics: Bridges (Structures), Engineering simulation, Microelectromechanical systems, Simulation, Temperature measurement, Pressure, Finite element analysis, Finite element model, Heat transfer, Materials properties
Proceedings Papers

An Opto-Thermal Micro-Disk Resonator for Temperature Detection

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Anisur Rahman, Sunil Kumar
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 531-535, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88572
https://doi.org/10.1115/HT2009-88572
View Paper titled, An Opto-Thermal Micro-Disk Resonator for Temperature Detection
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Topics: Disks, Temperature, Resonance, Sensors, Finite element analysis, Microelectromechanical systems, Simulation, Temperature sensors, Theoretical analysis, Wave propagation
Proceedings Papers

Experimental Measurement of Multiple Thermal Properties by Error Minimization

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Brian Smith, Cristina Amon
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 283-291, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32190
https://doi.org/10.1115/HT2007-32190
View Paper titled, Experimental Measurement of Multiple Thermal Properties by Error Minimization
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Topics: Errors, Fittings, Temperature measurement, Thermal properties, Thermoreflectance, Thin films, Polymer films, Actuators, Algorithms, Approximation
Proceedings Papers

Optical Resonance in Dielectric Micro-Sphere for Temperature Measurement

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Anisur Rahman, Sunil Kumar
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 303-312, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32468
https://doi.org/10.1115/HT2007-32468
View Paper titled, Optical Resonance in Dielectric Micro-Sphere for Temperature Measurement
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Topics: Resonance, Temperature measurement, Wavelength, Microelectromechanical systems, Temperature, Waves, Biomedicine, Electromagnetic theory, Nanotechnology, Q-factor
Proceedings Papers

Convective Heat Transfer of Nanofluids (DI Water-Al 2 O 3 ) in Micro-Channels

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Joohyun Lee, Roger D. Flynn, Kenneth E. Goodson, John K. Eaton
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 843-850, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32630
https://doi.org/10.1115/HT2007-32630
View Paper titled, Convective Heat Transfer of Nanofluids (DI Water-Al 2 O 3 ) in Micro-Channels
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Topics: Convection, Microchannels, Nanofluids, Water, Microelectromechanical systems, Nanoparticles, Stainless steel, Thermal conductivity, Boundary-value problems, Dynamic light scattering
Proceedings Papers

Effect of Conjugate Heat Transfer on MEMS-Based Thermal Shear Stress Sensor

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Jianghui Chao, Wei Shyy, Siddharth S. Thakur, Mark Sheplak, Renwei Mei
Proc. ASME. HT2005, Heat Transfer: Volume 4, 773-788, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72054
https://doi.org/10.1115/HT2005-72054
View Paper titled, Effect of Conjugate Heat Transfer on MEMS-Based Thermal Shear Stress Sensor
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Topics: Heat transfer, Microelectromechanical systems, Sensors, Shear stress
Proceedings Papers

Thermal Transport Network Model for High-Porosity Materials: Application to Nanoporous Aerogels

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Brian R. Smith, Peter D. Beutler, Cristina H. Amon
Proc. ASME. HT2005, Heat Transfer: Volume 4, 955-961, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72662
https://doi.org/10.1115/HT2005-72662
View Paper titled, Thermal Transport Network Model for High-Porosity Materials: Application to Nanoporous Aerogels
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Topics: Network models, Porosity, Thermal conductivity, Thermal properties, Heat, Manufacturing, Amorphous materials, Diffusion (Physics), Microelectromechanical systems, Microelectronic devices
Proceedings Papers

Independent Hybrid Power Plant “PEMFC+MEMS” With Use of Molecular Ceramic Membranes to Separate CO and H2

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A. V. Soudarev, A. A. Souryaninov, V. G. Konakov, A. S. Molchanov
Proc. ASME. HT2005, Heat Transfer: Volume 3, 29-36, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72243
https://doi.org/10.1115/HT2005-72243
View Paper titled, Independent Hybrid Power Plant “PEMFC+MEMS” With Use of Molecular Ceramic Membranes to Separate CO and H2
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Topics: Ceramics, Hybrid power systems, Membranes, Proton exchange membrane fuel cells, Coordinate measuring machines, Hybrid engines, Hydrogen, Microelectromechanical systems, Temperature, Catalysts
Proceedings Papers

Experiment of Micro Cantilever Deflection by Thermal Bubble Growth in Liquid

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Heon J. Lee, Young-Soo Chang, Ho-Young Kim, Jong-Seob Ahn, Yoon-Pyo Lee
Proc. ASME. HT2005, Heat Transfer: Volume 2, 487-489, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72486
https://doi.org/10.1115/HT2005-72486
View Paper titled, Experiment of Micro Cantilever Deflection by Thermal Bubble Growth in Liquid
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Topics: Bubbles, Deflection, Microcantilevers, Microelectromechanical systems, Atomic force microscopy, Cantilever beams, Cantilevers, Dry etching, Geometry, Manufacturing
Proceedings Papers

Laser Surface Texturing: Applications and Research Opportunities

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David A. Willis
Proc. ASME. HT2005, Heat Transfer: Volume 3, 311-313, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72676
https://doi.org/10.1115/HT2005-72676
View Paper titled, Laser Surface Texturing: Applications and Research Opportunities
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Topics: Lasers, Drops, Melting, Semiconductor wafers, Density, Displacement, Fluence (Radiation measurement), Metallic films, Metals, Microelectromechanical systems
Proceedings Papers

Aerogel for Microsystems Thermal Insulation: System Design and Process Development

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Brian Smith, David Romero, Damena Agonafer, Jason Gu, Cristina H. Amon
Proc. ASME. HT2005, Heat Transfer: Volume 4, 753-762, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72663
https://doi.org/10.1115/HT2005-72663
View Paper titled, Aerogel for Microsystems Thermal Insulation: System Design and Process Development
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Topics: Design, Microelectromechanical systems, Thermal insulation, Microelectronic devices, Crystals, Modeling, Sensors, Computer simulation, Electrical properties, Electronic systems
Proceedings Papers

Infrared Micro-Particle Image Velocimetry of Fluid Flow in Silicon-Based Microdevices

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Dong Liu, Suresh V. Garimella, Steve T. Wereley
Proc. ASME. HT-FED2004, Volume 4, 399-405, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56385
https://doi.org/10.1115/HT-FED2004-56385
View Paper titled, Infrared Micro-Particle Image Velocimetry of Fluid Flow in Silicon-Based Microdevices
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Topics: Fluid dynamics, Microparticles, Silicon, Flow measurement, Algorithms, Biomedicine, Computer cooling, Flow (Dynamics), Laminar flow, Light
Proceedings Papers

Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging

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Marios Alaeddine, Jin Zou, Rajesh Ranganathan, Charalabos C. Doumanidis, Teiichi Ando, Peter Y. Wong
Proc. ASME. HT-FED2004, Volume 3, 869-875, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56116
https://doi.org/10.1115/HT-FED2004-56116
View Paper titled, Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging
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Topics: Lasers, MEMS packaging, Modeling, Sealing (Process), Temperature, Heat, Intermetallic compounds, Microelectromechanical systems, Heating, Melting