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Proceedings Papers

Thermal Transport in Thermoelectric Coupled Nanoantennas

Edward Kinzel, Collin Finnan, Chao Dong, David Burghoff, Stephen M. White, Hadrian Aquino, Alexei O. Orlov, Wolfgang Porod, Gary H. Bernstein, Gergo P. Szakmany
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T03A003, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-107511
https://doi.org/10.1115/HT2023-107511
View Paper titled, Thermal Transport in Thermoelectric Coupled Nanoantennas
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Topics: Absorption, Carbon dioxide lasers, Cathode rays, Cavities, Circuits, Convection, Currents, Design, Dipoles (Electromagnetism), Electron beams
Proceedings Papers

Thermal Mixing Downstream of a 90-Degree T-Junction: Laminar and Turbulent Flows

Bakhtier Farouk
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T02A004, July 14–17, 2019
Publisher: American Society of Mechanical Engineers
Paper No: HT2019-3736
https://doi.org/10.1115/HT2019-3736
View Paper titled, Thermal Mixing Downstream of a 90-Degree T-Junction: Laminar and Turbulent Flows
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Topics: Junctions, Turbulence, Flow (Dynamics), Pipes, Temperature, Computational fluid dynamics, Large eddy simulation, Modeling, Simulation, Water
Proceedings Papers

An Investigation on Mechanism of Droplet Generation in High Inertial Gaseous Flow

Xinyu Yao, Zhenyu Liu, Huiying Wu
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T15A001, July 14–17, 2019
Publisher: American Society of Mechanical Engineers
Paper No: HT2019-3527
https://doi.org/10.1115/HT2019-3527
View Paper titled, An Investigation on Mechanism of Droplet Generation in High Inertial Gaseous Flow
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Topics: Drops, Gas flow, Junctions, Microchannels
Proceedings Papers

Two-Phase Flow Patterns in Microfluidic Cross-Shaped Junctions and Slug Hydrodynamics in the Dripping Regime

Zan Wu, Zhen Cao, Bengt Sunden
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T10A014, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4734
https://doi.org/10.1115/HT2017-4734
View Paper titled, Two-Phase Flow Patterns in Microfluidic Cross-Shaped Junctions and Slug Hydrodynamics in the Dripping Regime
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Topics: Hydrodynamics, Junctions, Microfluidics, Slug flows, Two-phase flow, Flow (Dynamics), Water, Fluids, Geometry, Glass
Proceedings Papers

Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles

Anand K. Patel, Weihuan Zhao
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T09A003, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4731
https://doi.org/10.1115/HT2017-4731
View Paper titled, Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles
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Topics: Cooling, Electric vehicles, Electronics, Graphite, Heat transfer, Vapors, Heat, Flat heat pipes, Copper, Heat flux
Proceedings Papers

Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A001, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7043
https://doi.org/10.1115/HT2016-7043
View Paper titled, Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness
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Topics: Metrology, Resolution (Optics), Steady state, Flow (Dynamics), Heat, Interfacial thermal resistance, Junctions, Measurement systems, Measurement uncertainty, Performance characterization
Proceedings Papers

Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction

Hua Bao, Shirui Luo, Ming Hu
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A039, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17176
https://doi.org/10.1115/HT2013-17176
View Paper titled, Enhancement of Interfacial Thermal Transport by Carbon Nanotube-Graphene Junction
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Topics: Carbon, Graphene, Junctions, Nanotubes, Carbon nanotubes, Energy dissipation, Heat, Silicon, Thermal conductivity, Engineering systems and industry applications
Proceedings Papers

Microscale Phase Separation Through Nanoporous Membranes

Abdy Fazeli, Saeed Moghaddam
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A009, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17633
https://doi.org/10.1115/HT2013-17633
View Paper titled, Microscale Phase Separation Through Nanoporous Membranes
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Topics: Membranes, Microscale devices, Phase separation, Bubbles, Microchannels, Pressure, Two-phase flow, Water, Air flow, Flow (Dynamics)
Proceedings Papers

Heat Dissipation Mechanism at Supported CNT-CNT Junctions

Liang Chen, Satish Kumar
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 559-566, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58283
https://doi.org/10.1115/HT2012-58283
View Paper titled, Heat Dissipation Mechanism at Supported CNT-CNT Junctions
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Topics: Carbon nanotubes, Energy dissipation, Heat, Junctions, Temperature, Density, Electromagnetic spectrum, Energy transformation, Molecular dynamics, Nanotubes
Proceedings Papers

One-Dimensional Simulation of a Stirling Three-Stage Pulse-Tube Refrigerator

M. A. Etaati, R. M. M. Mattheij, A. S. Tijsseling, A. T. A. M. de Waele
Proc. ASME. HT2009, Volume 3: Combustion, Fire and Reacting Flow; Heat Transfer in Multiphase Systems; Heat Transfer in Transport Phenomena in Manufacturing and Materials Processing; Heat and Mass Transfer in Biotechnology; Low Temperature Heat Transfer; Environmental Heat Transfer; Heat Transfer Education; Visualization of Heat Transfer, 749-756, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88087
https://doi.org/10.1115/HT2009-88087
View Paper titled, One-Dimensional Simulation of a Stirling Three-Stage Pulse-Tube Refrigerator
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Topics: Simulation, Temperature, Junctions, Boundary-value problems, Fluid dynamics, Pressure
Proceedings Papers

Computational Study of Conjugate Heat Transfer in T-Junctions

Simon Kuhn, Bojan Nicˇeno, Horst-Michael Prasser
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 889-896, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88451
https://doi.org/10.1115/HT2009-88451
View Paper titled, Computational Study of Conjugate Heat Transfer in T-Junctions
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Topics: Heat transfer, Junctions, Fatigue, Nuclear power stations, Water, Damping, Engineering simulation, Fluctuations (Physics), High temperature, Large eddy simulation
Proceedings Papers

Simulation of Charge Density and Field Distribution of a Gold Nanoparticle Tip-Terminated Scanning Nanowire Waveguide for Molecular Imaging

Nathan Malcolm, Alex J. Heltzel, Li Shi, John R. Howell
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 297-301, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88351
https://doi.org/10.1115/HT2009-88351
View Paper titled, Simulation of Charge Density and Field Distribution of a Gold Nanoparticle Tip-Terminated Scanning Nanowire Waveguide for Molecular Imaging
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Topics: Density, Imaging, Nanoparticles, Nanowires, Simulation, Waveguides, Boundary-value problems, Cantilevers, Cell membranes, Coating processes
Proceedings Papers

Development of a Transparent Heater to Measure Surface Temperature Fluctuations for Pool Boiling and Spray Cooling

Alison R. Griffin, Arun Vijayakumar, Ruey-Hung Chen, Kalpathy B. Sundaram, Louis C. Chow
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 197-204, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32218
https://doi.org/10.1115/HT2007-32218
View Paper titled, Development of a Transparent Heater to Measure Surface Temperature Fluctuations for Pool Boiling and Spray Cooling
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Topics: Cooling, Fluctuations (Physics), Pool boiling, Sprays, Temperature, Transparency, Bubbles, Junctions, Copper, Data acquisition systems
Proceedings Papers

Numerical Solution Methodology for Compact Thermal Models of Electronic Packages

Rohit Dev Gupta, Vinayak Eswaran
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 719-726, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32139
https://doi.org/10.1115/HT2007-32139
View Paper titled, Numerical Solution Methodology for Compact Thermal Models of Electronic Packages
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Topics: Electronic packages, Computational fluid dynamics, Convection, Junctions, Temperature, Algebra, Cooling, Fluid dynamics, Fluids, Heat transfer
Proceedings Papers

Thermal Interface Resistances in Nanostructures

Matthew Panzer, Ken Goodson
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 499-508, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32412
https://doi.org/10.1115/HT2007-32412
View Paper titled, Thermal Interface Resistances in Nanostructures
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Topics: Nanostructures , Phonons, Heat conduction, Acoustics, Density, Dimensions, Junctions, Lattice dynamics, Molecular dynamics, Photonic equipment
Proceedings Papers

Development of Thermal-Hydraulic Code Coupled With Heat Conduction in Structure for Thermal Striping Phenomena: Development of Calculation Module for Temperature Distribution in Structure

Masa-Aki Tanaka, Hiroyuki Ohshima
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 239-245, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32720
https://doi.org/10.1115/HT2007-32720
View Paper titled, Development of Thermal-Hydraulic Code Coupled With Heat Conduction in Structure for Thermal Striping Phenomena: Development of Calculation Module for Temperature Distribution in Structure
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Topics: Heat conduction, Temperature distribution, Computer simulation, Evaluation methods, Fluids, Temperature, Transient heat transfer, Breeder reactors, Computation, Computational methods
Proceedings Papers

Optimal Package Design of Stacks of Convection-Cooled Printed Circuit Boards Using Entropy Generation Minimization Method

Wen Jei Yang, Takahiro Furukawa, Shuichi Torii
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 479-485, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32195
https://doi.org/10.1115/HT2007-32195
View Paper titled, Optimal Package Design of Stacks of Convection-Cooled Printed Circuit Boards Using Entropy Generation Minimization Method
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Topics: Convection, Design, Entropy, Printed circuit boards, Optimization, Electronic packages, Geometry, Reynolds number, Channel flow, Cooling
Proceedings Papers

Experimental Study on Turbulent Flow and Mixing in Counter-Flow Type T-Junction

Masafumi Hirota, Hiroshi Nakayama, Sayaka Koide, Ippei Takeuchi
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 1099-1106, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32777
https://doi.org/10.1115/HT2007-32777
View Paper titled, Experimental Study on Turbulent Flow and Mixing in Counter-Flow Type T-Junction
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Topics: Flow (Dynamics), Junctions, Turbulence, Cycles, Fatigue, Oscillations
Proceedings Papers

Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency

Amip J. Shah, Anita Rogacs, Chandrakant D. Patel
Proc. ASME. HT2008, Heat Transfer: Volume 2, 653-662, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56210
https://doi.org/10.1115/HT2008-56210
View Paper titled, Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency
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Topics: Computers, Energy efficiency, Optimization, Thermal management, Cooling, Data centers, Density, Energy consumption, Temperature, Compacting
Proceedings Papers

Thermal Transport Measurements of Nanowire-Substrate Interfaces

Monalisa Mazumder, Theodorian Borca-Tasciuc
Proc. ASME. HT2008, Heat Transfer: Volume 1, 365-368, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56328
https://doi.org/10.1115/HT2008-56328
View Paper titled, Thermal Transport Measurements of Nanowire-Substrate Interfaces
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Topics: Nanowires, Atomic force microscopy, Nanostructures , Thermal resistance, Cantilevers, Conductive coatings, Data acquisition, Electrodes, Imaging, Junctions