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Proceedings Papers

Diffusion Bonded Compact Heat Exchanger in Inconel 740H for High Temperature and High-Pressure Applications

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Zhijun Jia, Thomas Parlow, Dane Kuhr, Mark Anderson, Brian Baker
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T10A004, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-81837
https://doi.org/10.1115/HT2022-81837
View Paper titled, Diffusion Bonded Compact Heat Exchanger in Inconel 740H for High Temperature and High-Pressure Applications
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Topics: Diffusion (Physics), Heat exchangers, High pressure (Physics), High temperature, Bonding, Alloys, Design, Diffusion bonding (Metals), Etching, Fluids
Proceedings Papers

An Investigation of Scale Variation in Multi-Layer Mini- and Micro-Channel Heat Sinks in Single Phase Flow Using a Two Equation Porous Media Model

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Bryan Hassell, Alfonso Ortega
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 873-881, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88423
https://doi.org/10.1115/HT2009-88423
View Paper titled, An Investigation of Scale Variation in Multi-Layer Mini- and Micro-Channel Heat Sinks in Single Phase Flow Using a Two Equation Porous Media Model
Open the PDF for An Investigation of Scale Variation in Multi-Layer Mini- and Micro-Channel Heat Sinks in Single Phase Flow Using a Two Equation Porous Media Model in another window
Topics: Flow (Dynamics), Heat sinks, Microchannels, Porous materials, Cutting, Etching, Flux (Metallurgy), Heat, Modeling, Pressure drop
Proceedings Papers

Cryogenic Heat Exchanger With Photo-Etched Mini-Perforated Plates Allowing Flow-Bypass

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Jeheon Jung, Sangkwon Jeong
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 503-508, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32607
https://doi.org/10.1115/HT2007-32607
View Paper titled, Cryogenic Heat Exchanger With Photo-Etched Mini-Perforated Plates Allowing Flow-Bypass
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Topics: Flow (Dynamics), Heat exchangers, Plates (structures), Heat conduction, Heat transfer, Stainless steel, Temperature, Channels (Hydraulic engineering), Convection, Copper
Proceedings Papers

Electron and Focused Ion Beams in Thermal Science and Engineering

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Tae-Youl Choi, Dimos Poulikakos
Proc. ASME. HT2008, Heat Transfer: Volume 1, 665-669, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56097
https://doi.org/10.1115/HT2008-56097
View Paper titled, Electron and Focused Ion Beams in Thermal Science and Engineering
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Topics: Electrons, Focused ion beams, Cathode ray oscilloscopes, Electron beams, Etching, Boiling, Carbon nanotubes, Ions, Nanolithography, Nanoscale phenomena
Proceedings Papers

Computational Study of Reactive Flow in Halide Chemical Vapor Deposition of Silicon Carbide Epitaxial Film

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Rong Wang, Ronghui Ma
Proc. ASME. HT2008, Heat Transfer: Volume 3, 207-213, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56313
https://doi.org/10.1115/HT2008-56313
View Paper titled, Computational Study of Reactive Flow in Halide Chemical Vapor Deposition of Silicon Carbide Epitaxial Film
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Topics: Chemical vapor deposition, Chemically reactive flow, Silicon, Temperature, Chemical reactions, Computer simulation, Design, Electromagnetic induction, Engineering simulation, Etching
Proceedings Papers

Fluid Flow and Heat Transfer in a Composite Trapezoidal Microchannel

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Muhammad M. Rahman, Shantanu S. Shevade
Proc. ASME. HT2005, Heat Transfer: Volume 1, 411-417, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72407
https://doi.org/10.1115/HT2005-72407
View Paper titled, Fluid Flow and Heat Transfer in a Composite Trapezoidal Microchannel
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Topics: Composite materials, Fluid dynamics, Heat transfer, Microchannels, Gadolinium, Fluids, Heat, Heat exchangers, Heat transfer coefficients, Magnetic fields
Proceedings Papers

High Performance Thin Film Transistors (TFTs) of Polycrystalline Silicon Crystallized by the Double Laser Crystallization (DLC) Technique

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Li Xu, Costas P. Grigoropoulos
Proc. ASME. HT2005, Heat Transfer: Volume 3, 271-276, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72223
https://doi.org/10.1115/HT2005-72223
View Paper titled, High Performance Thin Film Transistors (TFTs) of Polycrystalline Silicon Crystallized by the Double Laser Crystallization (DLC) Technique
Open the PDF for High Performance Thin Film Transistors (TFTs) of Polycrystalline Silicon Crystallized by the Double Laser Crystallization (DLC) Technique in another window
Topics: Crystallization, Lasers, Polysilicon, Thin film transistors, Crystal growth, Etching, Grain size, Mechanical admittance, Melting, Scanning electron microscopes
Proceedings Papers

Feature Evolution During Sub 100NM Gap-Fill and Etch

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Hemant Mungekar, Young S. Lee, Shankar Venkataraman
Proc. ASME. HT2005, Heat Transfer: Volume 3, 221-224, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72326
https://doi.org/10.1115/HT2005-72326
View Paper titled, Feature Evolution During Sub 100NM Gap-Fill and Etch
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Topics: Etching, Pressure, Plasmas (Ionized gases), Design, Electric fields, Electronics, Integrated circuit fabrication, Ions, Plasma density, Process design
Proceedings Papers

Modeling and Simulation of Physical Vapor Deposition/Etching Plasmas

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Umesh Kelkar, Arvind Sundarrajan, Tza-Jing Gung, Ned Hammond, Ajay Bhatnagar, Xinyu Fu, Mark Perrin, John Forster, Prabu Gopalraja, Jianming Fu
Proc. ASME. HT2005, Heat Transfer: Volume 3, 225-227, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72338
https://doi.org/10.1115/HT2005-72338
View Paper titled, Modeling and Simulation of Physical Vapor Deposition/Etching Plasmas
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Topics: Etching, Modeling, Plasmas (Ionized gases), Simulation, Vapor deposition, Flux (Metallurgy), Magnetic fields, Particulate matter, Semiconductor wafers, Simulation results
Proceedings Papers

Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling

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Robert J. Stevens, Pamela M. Norris, Arthur W. Lichtenberger
Proc. ASME. HT-FED2004, Volume 4, 503-504, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56556
https://doi.org/10.1115/HT-FED2004-56556
View Paper titled, Experimental Determination of the Relationship Between Thermal Boundary Resistance and Non-Abrupt Interfaces and Electron-Phonon Coupling
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Topics: Electrons, Interfacial thermal resistance, Phonons, Temperature, Electron scattering, Acoustics, Diamonds, Electrical conductance, Electromagnetic scattering, Metals