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Proceedings Papers

Optimization of Thermal Management in Power Electronics by the Design of Split Channel Cooling Systems Through Numerical Simulations

Hooman Taghavi, Sowmya Raghu, Jamil A. Khan
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T11A008, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131517
https://doi.org/10.1115/HT2024-131517
View Paper titled, Optimization of Thermal Management in Power Electronics by the Design of Split Channel Cooling Systems Through Numerical Simulations
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Topics: Computer simulation, Cooling systems, Design, Electronics, Heat transfer, Optimization, Thermal management
Proceedings Papers

Analytical Study of the Thermal Performance for an Embedded Microfluidic Cooling System

Jarred Wilhite, Chirag Kharangate
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T11A004, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131005
https://doi.org/10.1115/HT2024-131005
View Paper titled, Analytical Study of the Thermal Performance for an Embedded Microfluidic Cooling System
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Topics: Cooling, Cooling systems, Manifolds, Microchannels, Microfluidics, Heat, Silicon carbide, Energy dissipation, Fluids, Computer cooling
Proceedings Papers

Heat Transfer of Supercritical CO 2 Near the Critical Condition Inside a Microchannel

Pranzal Ahmed, Anatoly Parahovnik, Yoav Peles
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T10A001, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-105751
https://doi.org/10.1115/HT2023-105751
View Paper titled, Heat Transfer of Supercritical CO 2 Near the Critical Condition Inside a Microchannel
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Topics: Electronics, Heat transfer, Microchannels, Supercritical carbon dioxide, Thermal management
Proceedings Papers

An Experimental Study on Heat Transfer Performance of Jet Impingement Arrays

Zhen Cao, Bengt Sundén, Jiahong Fu
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T12A003, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-81617
https://doi.org/10.1115/HT2022-81617
View Paper titled, An Experimental Study on Heat Transfer Performance of Jet Impingement Arrays
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Topics: Heat transfer, Impingement cooling, Liquid crystals, Cooling, Computer cooling, Electronics, Heating, Thermal management
Proceedings Papers

A Comparative Study of 1-D and 3-D Simulation Methodologies To Predict the Thermal Performance of a Power Electronics Hardware

Ankit Tiwari, Craig Whitaker, Brian Kendall
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T06A001, June 16–18, 2021
Publisher: American Society of Mechanical Engineers
Paper No: HT2021-62306
https://doi.org/10.1115/HT2021-62306
View Paper titled, A Comparative Study of 1-D and 3-D Simulation Methodologies To Predict the Thermal Performance of a Power Electronics Hardware
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Topics: Computational fluid dynamics, Electronics, Hardware, Heat transfer, Simulation, Radiation (Physics), Thermal analysis, Convection, Heat sinks, Temperature
Proceedings Papers

A Novel Fast Predicting Technique for the Absorptivity of Surface Coating

Emir Özkökdemir, Berkay Filiz, Yener Usul
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T12A001, June 16–18, 2021
Publisher: American Society of Mechanical Engineers
Paper No: HT2021-61956
https://doi.org/10.1115/HT2021-61956
View Paper titled, A Novel Fast Predicting Technique for the Absorptivity of Surface Coating
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Topics: Coating processes, Coatings, Solar radiation, Aluminum plate, Simulation, Electronics, Errors, Finite element analysis, Finite element model, Heat capacity
Proceedings Papers

Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics

Jin Yao Ho, Kai Choong Leong
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T09A013, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-9143
https://doi.org/10.1115/HT2020-9143
View Paper titled, Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics
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Topics: Cooling, Electronics, Heat sinks, Topology, Heat, Temperature, Aluminum alloys, Energy dissipation, Flux (Metallurgy), Lasers
Proceedings Papers

Transient Determination on the Bulk Thermal Conductivity of Sub-Millimeter Thin Films of Composite Phase Change Thermal Interfacial Materials

Yu-Hong Zhang, Biao Feng, Jing Tu, Li-Wu Fan
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T14A001, July 14–17, 2019
Publisher: American Society of Mechanical Engineers
Paper No: HT2019-3520
https://doi.org/10.1115/HT2019-3520
View Paper titled, Transient Determination on the Bulk Thermal Conductivity of Sub-Millimeter Thin Films of Composite Phase Change Thermal Interfacial Materials
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Topics: Composite materials, Thermal conductivity, Thin films, Transients (Dynamics), Thermal management, Contact resistance, Design, Electronics, Instrumentation, Phase change materials
Proceedings Papers

Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles

Anand K. Patel, Weihuan Zhao
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T09A003, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4731
https://doi.org/10.1115/HT2017-4731
View Paper titled, Heat Transfer Analysis of Graphite Foam Embedded Vapor Chamber for Cooling of Power Electronics in Electric Vehicles
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Topics: Cooling, Electric vehicles, Electronics, Graphite, Heat transfer, Vapors, Heat, Flat heat pipes, Copper, Heat flux
Proceedings Papers

Numerical Analysis of Thermal Transport in Nano Fluidic Porous Filled Heat Exchangers for Electronics Cooling

Carlos Zing, Shadi Mahjoob
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A009, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4966
https://doi.org/10.1115/HT2017-4966
View Paper titled, Numerical Analysis of Thermal Transport in Nano Fluidic Porous Filled Heat Exchangers for Electronics Cooling
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Topics: Computer cooling, Heat exchangers, Numerical analysis, Water, Coolants, Cooling, Copper, Electronics, Nanofluids, Operating temperature
Proceedings Papers

Investigation of the Thermal Behaviour of Thin Phase Change Material Packages as a Solution to Temperature Control in Electronics

Benjamin Sponagle, Simon Maranda, Dominic Groulx
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A004, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4801
https://doi.org/10.1115/HT2017-4801
View Paper titled, Investigation of the Thermal Behaviour of Thin Phase Change Material Packages as a Solution to Temperature Control in Electronics
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Topics: Electronics, Phase change materials, Temperature control, Temperature, Computer simulation, Electronic systems, Finite element methods, Thermal energy storage, Thermal management
Proceedings Papers

ASETS-II Oscillating Heat Pipe Space Flight Experiment: Ground Truth Results

Brent S. Taft, Sally M. Smith
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T01A001, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4706
https://doi.org/10.1115/HT2017-4706
View Paper titled, ASETS-II Oscillating Heat Pipe Space Flight Experiment: Ground Truth Results
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Topics: Heat pipes, Space flight, Flight, Hardware, Testing, Uncertainty, Boundary-value problems, Design, Electronics, Fluids
Proceedings Papers

Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications

David Gonzalez-Nino, Lauren M. Boteler, Dimeji Ibitayo, Nicholas R. Jankowski, Pedro O. Quintero
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A004, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7223
https://doi.org/10.1115/HT2016-7223
View Paper titled, Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications
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Topics: Electronics, Phase change materials, Heat, Tin, Transients (Dynamics), Stress, Thermal conductivity, Absorption, Finite difference methods, Gallium
Proceedings Papers

Thermal Contact Conductance of Radiation-Aged Thermal Interface Materials for Space Applications

Robert A. Sayer, Timothy P. Koehler, Scott M. Dalton, Thomas W. Grasser, Ronald L. Akau
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A002, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17408
https://doi.org/10.1115/HT2013-17408
View Paper titled, Thermal Contact Conductance of Radiation-Aged Thermal Interface Materials for Space Applications
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Topics: Contact resistance, Radiation (Physics), Design, Gamma rays, Electronics, Flow (Dynamics), Heat, Heat transfer, Irradiation (Radiation exposure), Pressure
Proceedings Papers

3D Thermal Resistance Network Method for the Design of Highly Integrated Packages

Lauren Boteler, Andrew Smith
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A009, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17575
https://doi.org/10.1115/HT2013-17575
View Paper titled, 3D Thermal Resistance Network Method for the Design of Highly Integrated Packages
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Topics: Design, Thermal resistance, Packaging, Resistors, Temperature, Cooling, Dimensions, Electronics, Computer simulation, Energy dissipation
Proceedings Papers

Thermally-Induced Dispersion of Coolant Mixtures Through Heated Layered Materials

B. S. Tilley
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A010, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17737
https://doi.org/10.1115/HT2013-17737
View Paper titled, Thermally-Induced Dispersion of Coolant Mixtures Through Heated Layered Materials
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Topics: Coolants, Laminates, Microscale devices, Fluids, Geometry, Heat, Design, Electronics, Flow (Dynamics), Heat sinks
Proceedings Papers

An Experimental Study of a Multi-Device Jet Impingement Cooler With Phase Change Using HFE-7100

Shailesh N. Joshi, Matthew J. Rau, Ercan M. Dede, Suresh V. Garimella
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A004, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17059
https://doi.org/10.1115/HT2013-17059
View Paper titled, An Experimental Study of a Multi-Device Jet Impingement Cooler With Phase Change Using HFE-7100
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Topics: Cooling, Critical heat flux, Density, Design, Electronics, Fluids, Flux (Metallurgy), Heart failure, Heat, Heat transfer
Proceedings Papers

A Numerical Study of a Single Unsteady Laminar Slot Jet in a Confined Structure

Omidreza Ghaffari, M. Baris Dogruoz, Mehmet Arik
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A008, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17833
https://doi.org/10.1115/HT2013-17833
View Paper titled, A Numerical Study of a Single Unsteady Laminar Slot Jet in a Confined Structure
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Topics: Cooling, Electronics, Flow (Dynamics), Heat transfer, Jets, Nozzles, Pressure, Transients (Dynamics)
Proceedings Papers

Recent Advances in High-Flux, Two-Phase Thermal Management

Issam Mudawar
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A041, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17046
https://doi.org/10.1115/HT2013-17046
View Paper titled, Recent Advances in High-Flux, Two-Phase Thermal Management
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Topics: Algorithms, Avionics, Computers, Coolants, Cooling, Cooling systems, Data centers, Databases, Design, Electric vehicles
Proceedings Papers

Flow Boiling Dynamics of Water and Nanofluids in a Single Microchannel at Different Heat Fluxes

Zachary Edel, Abhijit Mukherjee
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A019, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17492
https://doi.org/10.1115/HT2013-17492
View Paper titled, Flow Boiling Dynamics of Water and Nanofluids in a Single Microchannel at Different Heat Fluxes
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Topics: Boiling, Dynamics (Mechanics), Flow (Dynamics), Flux (Metallurgy), Heat, Microchannels, Nanofluids, Water, Bubbles, Nanoparticles