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Proceedings Papers

Thermal and Electrical Conductance of Pressure Tube/Calandria Tube Interface

Chukwudi Azih, Reilly MacCoy, Hazem Mazhar, Chris Fraser
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T11A005, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-9092
https://doi.org/10.1115/HT2020-9092
View Paper titled, Thermal and Electrical Conductance of Pressure Tube/Calandria Tube Interface
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Topics: Electrical conductance, Pressure, Boiling, Accidents, Contact resistance, Heat transfer, Temperature, Thermal conductivity, Coolants, Fuels
Proceedings Papers

Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments

Siddharth Saurav, Sandip Mazumder
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T15A001, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: HT2020-8920
https://doi.org/10.1115/HT2020-8920
View Paper titled, Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments
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Topics: Thermal conductivity, Thermoreflectance, Heat conduction, Boundary-value problems, Transducers, Cooling, Electrical conductance, Heat, Lasers, Pumps
Proceedings Papers

Nanoscale Thermal Radiation Between Coated Spheres

Braden Czapla, Arvind Narayanaswamy
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T13A004, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4852
https://doi.org/10.1115/HT2017-4852
View Paper titled, Nanoscale Thermal Radiation Between Coated Spheres
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Topics: Coatings, Electrical conductance, Nanoscale phenomena, Phonons, Polaritons, Radiative heat transfer, Reflectance, Silver, Thermal radiation
Proceedings Papers

Prediction of Thermal Boundary Conductance at the Interface With Phonon Wave-Packet Simulations: The Roles of Vibrational Spectra Differences, Interface Bond Strength, and Inelastic Scattering

ChangJin Choi, W. Tanner Yorgason, Nicholas A. Roberts
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A003, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7177
https://doi.org/10.1115/HT2016-7177
View Paper titled, Prediction of Thermal Boundary Conductance at the Interface With Phonon Wave-Packet Simulations: The Roles of Vibrational Spectra Differences, Interface Bond Strength, and Inelastic Scattering
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Topics: Bond strength, Electrical conductance, Electromagnetic scattering, Engineering simulation, Phonons, Radiation scattering, Scattering (Physics), Simulation, Vibrational spectra, Wave packets
Proceedings Papers

The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance

Ramez Cheaito, John C. Duda, Thomas E. Beechem, Jon F. Ihlefeld, Khalid Hattar, Edward S. Piekos, Amit Misra, Jon K. Baldwin, Patrick E. Hopkins
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A009, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17541
https://doi.org/10.1115/HT2013-17541
View Paper titled, The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance
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Topics: Copper, Electrical conductance, Electron transport, Electromagnetic scattering, Electrons, Metals, Thermal conductivity, Resistors, Temperature, Thermoreflectance
Proceedings Papers

Tuning Near Field Radiation by Doped Silicon

Jiawei Shi, Sheng Shen
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A002, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17092
https://doi.org/10.1115/HT2013-17092
View Paper titled, Tuning Near Field Radiation by Doped Silicon
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Topics: Radiation (Physics), Silicon, Electrical conductance, Nanoscale phenomena
Proceedings Papers

Molecular Dynamics Study of the Interfacial Thermal Conductance at the Graphene/Paraffin Interface in Solid and Liquid Phases

Hasan Babaei, Pawel Keblinski, J. M. Khodadadi
Proc. ASME. HT2013, Volume 4: Heat and Mass Transfer Under Extreme Conditions; Environmental Heat Transfer; Computational Heat Transfer; Visualization of Heat Transfer; Heat Transfer Education and Future Directions in Heat Transfer; Nuclear Energy, V004T14A018, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17478
https://doi.org/10.1115/HT2013-17478
View Paper titled, Molecular Dynamics Study of the Interfacial Thermal Conductance at the Graphene/Paraffin Interface in Solid and Liquid Phases
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Topics: Graphene, Molecular dynamics, Paraffin wax, Thermal conductivity, Electrical conductance, Engineering simulation, Heat, Simulation, Equilibrium (Physics), Flow (Dynamics)
Proceedings Papers

Characterization of Thermal Interface Materials Using a Steady State Experimental Method

Benjamin Sponagle, Dominic Groulx
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 641-648, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58262
https://doi.org/10.1115/HT2012-58262
View Paper titled, Characterization of Thermal Interface Materials Using a Steady State Experimental Method
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Topics: Steady state, Electrical conductance, ASTM International, Flow (Dynamics), Heat, Testing
Proceedings Papers

Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques

Patrick E. Hopkins, Justin R. Serrano, Leslie M. Phinney
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 497-503, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88269
https://doi.org/10.1115/HT2009-88269
View Paper titled, Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques
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Topics: Electrical conductance, Probes, Pumps, Thermal conductivity, Thermoreflectance, Locks (Waterways), Signals, Top-tensioned risers, Heating, Thin films
Proceedings Papers

A Tunable Magnetomechanical Thermal Switch for Thermal Management Purposes

Katherine E. Bulgrin, Y. Sungtaek Ju, Greg P. Carman, Adrienne S. Lavine
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 997-1003, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88571
https://doi.org/10.1115/HT2009-88571
View Paper titled, A Tunable Magnetomechanical Thermal Switch for Thermal Management Purposes
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Topics: Switches, Thermal management, Electrical conductance, Heat, Temperature, Computer simulation, Design, Ferromagnetic materials, Heat flux, Temperature effects
Proceedings Papers

Pressure Gradient Variations During Reflux Condensation in a Closed Thermosyphon

Siamak Moaveninejad, Mohammad Mahdi Heyhat
Proc. ASME. HT2009, Volume 3: Combustion, Fire and Reacting Flow; Heat Transfer in Multiphase Systems; Heat Transfer in Transport Phenomena in Manufacturing and Materials Processing; Heat and Mass Transfer in Biotechnology; Low Temperature Heat Transfer; Environmental Heat Transfer; Heat Transfer Education; Visualization of Heat Transfer, 417-424, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88480
https://doi.org/10.1115/HT2009-88480
View Paper titled, Pressure Gradient Variations During Reflux Condensation in a Closed Thermosyphon
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Topics: Condensation, Electrical conductance, Pressure gradient
Proceedings Papers

Analysis of Microscale Heat Transfer and Ultrafast Thermoelasticity in a Multi-Layered Metal Film

Tsung-Wen Tsai, Yung-Ming Lee, Yang-Hsu Liao
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 87-95, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88081
https://doi.org/10.1115/HT2009-88081
View Paper titled, Analysis of Microscale Heat Transfer and Ultrafast Thermoelasticity in a Multi-Layered Metal Film
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Topics: Electrical conductance, Metallic films, Microscale heat transfer, Thermoelasticity
Proceedings Papers

Characterisation of a Variable Conductance Heat Pipe Prototype for a Photonic Application

Martin Cleary, Ronan Grimes, Marc Hodes, Mark T. North
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 313-320, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32623
https://doi.org/10.1115/HT2007-32623
View Paper titled, Characterisation of a Variable Conductance Heat Pipe Prototype for a Photonic Application
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Topics: Electrical conductance, Engineering prototypes, Heat pipes, Temperature control
Proceedings Papers

Thermal Performance of Pin Fins at Low Reynolds Numbers in Mini-Micro-Channels

A. Rozati, D. K. Tafti, N. E. Blackwell
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 121-129, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32158
https://doi.org/10.1115/HT2007-32158
View Paper titled, Thermal Performance of Pin Fins at Low Reynolds Numbers in Mini-Micro-Channels
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Topics: Fins, Reynolds number, Density, Friction, Heat transfer, Pins (Engineering), Wakes, Electrical conductance, Form drag, Heat
Proceedings Papers

Modeling of Subcontinuum Thermal Transport Across Semiconductor-Gas Interfaces

Dhruv Singh, Xiaohui Guo, Alina Alexeenko, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. HT2008, Heat Transfer: Volume 1, 389-400, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56427
https://doi.org/10.1115/HT2008-56427
View Paper titled, Modeling of Subcontinuum Thermal Transport Across Semiconductor-Gas Interfaces
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Topics: Modeling, Semiconductors (Materials), Phonons, Equilibrium (Physics), Heat transfer, Temperature, Algorithms, Electrical conductance, Energy budget (Physics), Gas flow
Proceedings Papers

Numerical Investigation on Thermal and Fluid Dynamic Behaviors of Air Conditioning in Aircraft Cabin

G. Balducci, V. Bianco, O. Manca, S. Nardini, M. Roma
Proc. ASME. HT2008, Heat Transfer: Volume 3, 387-394, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56326
https://doi.org/10.1115/HT2008-56326
View Paper titled, Numerical Investigation on Thermal and Fluid Dynamic Behaviors of Air Conditioning in Aircraft Cabin
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Topics: Air conditioning, Aircraft, Fluids, Temperature, Electrical conductance, Heat, Heat transfer coefficients, Pressure, Skin, Thermofluids
Proceedings Papers

PIV Measurements in the Condenser Region of a Gas-Loaded Thermosyphon

Martin Cleary, Ronan Grimes, Marc Hodes, Mark T. North
Proc. ASME. HT2008, Heat Transfer: Volume 3, 651-658, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56402
https://doi.org/10.1115/HT2008-56402
View Paper titled, PIV Measurements in the Condenser Region of a Gas-Loaded Thermosyphon
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Topics: Condensers (steam plant), Flow (Dynamics), Vapors, Heat, Temperature, Heat pipes, Particulate matter, Stress, Coolants, Cycles
Proceedings Papers

A Dynamic Heat Transfer Analysis of a Three Sided Pyramidal Fin of Scalene Triangular Cross-Sectional Area

Richard G. Carranza
Proc. ASME. HT2008, Heat Transfer: Volume 2, 1-4, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56011
https://doi.org/10.1115/HT2008-56011
View Paper titled, A Dynamic Heat Transfer Analysis of a Three Sided Pyramidal Fin of Scalene Triangular Cross-Sectional Area
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Topics: Convection, Dynamic analysis, Electrical conductance, Fluids, Heat conduction, Heat transfer, Steady state, Temperature, Temperature profiles, Thermal conductivity
Proceedings Papers

Polymeric Hollow Fiber Heat Exchangers (PHFHEs): A New Type of Compact Heat Exchanger for Lower Temperature Applications

Dimitrios M. Zarkadas, Baoan Li, Kamalesh K. Sirkar
Proc. ASME. HT2005, Heat Transfer: Volume 4, 429-438, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72590
https://doi.org/10.1115/HT2005-72590
View Paper titled, Polymeric Hollow Fiber Heat Exchangers (PHFHEs): A New Type of Compact Heat Exchanger for Lower Temperature Applications
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Topics: Fibers, Heat exchangers, Temperature, Metals, Heat transfer, Shells, Water, Condensation, Drugs, Steam
Proceedings Papers

Variable Conductance Two-Phase Closed Flat Plate Thermosyphon With Binary Mixture

H. Shokouhmand, N. Sharifi
Proc. ASME. HT2005, Heat Transfer: Volume 4, 659-668, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72737
https://doi.org/10.1115/HT2005-72737
View Paper titled, Variable Conductance Two-Phase Closed Flat Plate Thermosyphon With Binary Mixture
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Topics: Electrical conductance, Flat plates, Momentum, Heat transfer, Liquid films, Pressure, Shear stress, Stress, Temperature, Vapors