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Proceedings Papers

Analytical Study of the Thermal Performance for an Embedded Microfluidic Cooling System

Jarred Wilhite, Chirag Kharangate
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T11A004, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131005
https://doi.org/10.1115/HT2024-131005
View Paper titled, Analytical Study of the Thermal Performance for an Embedded Microfluidic Cooling System
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Topics: Cooling, Cooling systems, Manifolds, Microchannels, Microfluidics, Heat, Silicon carbide, Energy dissipation, Fluids, Computer cooling
Proceedings Papers

A Loop Heat Pipe for Vehicle CPU Cooling: Peak Performance and Partial Flooding and Dryout Regimes

Julio Ferreira, Massoud Kaviany, Vincent Dupont, Olivier de Laet, Thomas Nicolle, Erik Yen
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A001, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-83836
https://doi.org/10.1115/HT2022-83836
View Paper titled, A Loop Heat Pipe for Vehicle CPU Cooling: Peak Performance and Partial Flooding and Dryout Regimes
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Topics: Computer cooling, Floods, Heat pipes, Vehicles
Proceedings Papers

Optimal Design of Additively Manufactured Metal Lattice Heat Sinks for Electronics Cooling

Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A002, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-85400
https://doi.org/10.1115/HT2022-85400
View Paper titled, Optimal Design of Additively Manufactured Metal Lattice Heat Sinks for Electronics Cooling
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Topics: Additive manufacturing, Computer cooling, Cooling, Design, Heat sinks, Metals, Optimization, Thermal management
Proceedings Papers

Thermal Fluid Assessment of Bluff Versus Streamlined Bodies With a Slot for Aligned Flow

Sultan Alshareef, Todd Harman, Tim Ameel
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T12A001, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-80024
https://doi.org/10.1115/HT2022-80024
View Paper titled, Thermal Fluid Assessment of Bluff Versus Streamlined Bodies With a Slot for Aligned Flow
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Topics: Flow (Dynamics), Thermofluids, Drag (Fluid dynamics), Heat transfer, Entropy, Heat, Air flow, Computer cooling, Convection, Engineering simulation
Proceedings Papers

An Experimental Study on Heat Transfer Performance of Jet Impingement Arrays

Zhen Cao, Bengt Sundén, Jiahong Fu
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T12A003, July 11–13, 2022
Publisher: American Society of Mechanical Engineers
Paper No: HT2022-81617
https://doi.org/10.1115/HT2022-81617
View Paper titled, An Experimental Study on Heat Transfer Performance of Jet Impingement Arrays
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Topics: Heat transfer, Impingement cooling, Liquid crystals, Cooling, Computer cooling, Electronics, Heating, Thermal management
Proceedings Papers

Numerical Analysis of Heat Transfer in a Laminar, Submerged, Slot Jet Impinging on an Oscillating Wall

Srivathsan Ragunathan, Douglas J. Goering
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T02A003, July 14–17, 2019
Publisher: American Society of Mechanical Engineers
Paper No: HT2019-3633
https://doi.org/10.1115/HT2019-3633
View Paper titled, Numerical Analysis of Heat Transfer in a Laminar, Submerged, Slot Jet Impinging on an Oscillating Wall
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Topics: Heat transfer, Numerical analysis, Oscillations, Jets, Reynolds number, Computational fluid dynamics, Computer cooling, Computer simulation, Finite volume methods, Flow (Dynamics)
Proceedings Papers

Phase Change Materials (PCMs) in a Parallel Squared Honeycomb System for Electronic Cooling

Bernardo Buonomo, Davide Ercole, Oronzio Manca, Laura Fedele, Simone Mancin
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T11A017, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4980
https://doi.org/10.1115/HT2017-4980
View Paper titled, Phase Change Materials (PCMs) in a Parallel Squared Honeycomb System for Electronic Cooling
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Topics: Computer cooling, Honeycomb structures, Phase change materials, Computer simulation, Porous materials, Aluminum, Cooling, Equilibrium (Physics), Fluids, Heat transfer
Proceedings Papers

Fabrication and Thermal Characterization of Novel Copper-CNT Micropillars for Electronics Cooling Applications

Siavash Ghanbari, Jeff Darabi
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A008, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4935
https://doi.org/10.1115/HT2017-4935
View Paper titled, Fabrication and Thermal Characterization of Novel Copper-CNT Micropillars for Electronics Cooling Applications
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Topics: Carbon nanotubes, Computer cooling, Copper, Manufacturing, Thermal characterization, Composite materials, Pressure, Carbon, Cooling systems, Electrodeposition
Proceedings Papers

Numerical Analysis of Thermal Transport in Nano Fluidic Porous Filled Heat Exchangers for Electronics Cooling

Carlos Zing, Shadi Mahjoob
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A009, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4966
https://doi.org/10.1115/HT2017-4966
View Paper titled, Numerical Analysis of Thermal Transport in Nano Fluidic Porous Filled Heat Exchangers for Electronics Cooling
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Topics: Computer cooling, Heat exchangers, Numerical analysis, Water, Coolants, Cooling, Copper, Electronics, Nanofluids, Operating temperature
Proceedings Papers

Transient Analysis of a Cylindrical Heat Pipe Considering Different Wick Structures

Mehdi Famouri, M. Mahdi Abdollahzadeh, Ahmed Abdulshaheed, GuangHan Huang, Gerardo Carbajal, Chen Li
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A023, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7469
https://doi.org/10.1115/HT2016-7469
View Paper titled, Transient Analysis of a Cylindrical Heat Pipe Considering Different Wick Structures
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Topics: Heat pipes, Transient analysis, Vapors, Algorithms, Computer cooling, Cooling, Evaporation, Fluid dynamics, Fluids, Heat transfer
Proceedings Papers

Numerical Investigation of Heat Transfer Characteristics of a Novel Wavy-Tapered Microchannel Heat Sink

Ahmed Eltaweel, Abdulla Baobeid, Brian Tompkins, Ibrahim Hassan
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A009, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7432
https://doi.org/10.1115/HT2016-7432
View Paper titled, Numerical Investigation of Heat Transfer Characteristics of a Novel Wavy-Tapered Microchannel Heat Sink
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Topics: Heat sinks, Heat transfer, Microchannels, Flow (Dynamics), Thermal resistance, Computer cooling, Coolants, Design, Engineering simulation, Fluid dynamics
Proceedings Papers

Flow and Heat Transfer Study of an Impinging Piezoelectric Fan Over a Vertical Surface

Shadi Habibi Parsa, Omidreza Ghaffari, Stephen Solovitz, Mehmet Arik
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A003, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7097
https://doi.org/10.1115/HT2016-7097
View Paper titled, Flow and Heat Transfer Study of an Impinging Piezoelectric Fan Over a Vertical Surface
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Topics: Flow (Dynamics), Heat transfer, Blades, Computer cooling, Cooling, Copper, Deflection, Fans, Oscillations, Particulate matter
Proceedings Papers

Experimental and Numerical Investigation on Mixed Convection in Horizontal Channels Partially Filled With Aluminum Foam and Heated From Below

Bernardo Buonomo, Luca Cirillo, Oronzio Manca, Sergio Nardini
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T03A002, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7256
https://doi.org/10.1115/HT2016-7256
View Paper titled, Experimental and Numerical Investigation on Mixed Convection in Horizontal Channels Partially Filled With Aluminum Foam and Heated From Below
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Topics: Aluminum, Mixed convection, Flow (Dynamics), Wall temperature, Buoyancy, Cavity walls, Chemical vapor deposition, Computer cooling, Flow visualization, Forced convection
Proceedings Papers

Toward Modular Prediction of Free-Surface Jet Array Cooling: The Hydraulic Jump Location and Non-Monotonous Heat Transfer

Herman D. Haustein
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A020, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7400
https://doi.org/10.1115/HT2016-7400
View Paper titled, Toward Modular Prediction of Free-Surface Jet Array Cooling: The Hydraulic Jump Location and Non-Monotonous Heat Transfer
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Topics: Cooling, Heat transfer, Hydraulic jump, Jets, Flow (Dynamics), Water, Computer cooling, Cross-flow, Evacuations, Floods
Proceedings Papers

Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling

Francesco Agostini, Thomas Gradinger, Didier Cottet
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A015, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17058
https://doi.org/10.1115/HT2013-17058
View Paper titled, Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling
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Topics: Computer cooling, Condensers (steam plant), Cooling, Flow (Dynamics), Fluids, Gravity (Force), Heat sinks, Pressure drop, Refrigerants, Semiconductors (Materials)
Proceedings Papers

Effects of Channel Aspect Ratio on Convective Heat Transfer in an Electronics Cooling Heat Sink Having Agitation and Fan-Induced Throughflow

Smita Agrawal, Longzhong Huang, Terrence Simon, Mark North, Tianhong Cui
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A017, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17182
https://doi.org/10.1115/HT2013-17182
View Paper titled, Effects of Channel Aspect Ratio on Convective Heat Transfer in an Electronics Cooling Heat Sink Having Agitation and Fan-Induced Throughflow
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Topics: Computer cooling, Convection, Heat sinks
Proceedings Papers

Heat Transfer and Pressure Drop Characteristics of a Liquid Cooled Manifold-Microgroove Condenser

David Boyea, Amir Shooshtari, Serguei V. Dessiatoun, Michael M. Ohadi
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A003, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17781
https://doi.org/10.1115/HT2013-17781
View Paper titled, Heat Transfer and Pressure Drop Characteristics of a Liquid Cooled Manifold-Microgroove Condenser
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Topics: Condensers (steam plant), Heat transfer, Manifolds, Pressure drop, Heat transfer coefficients, Refrigerants, Heat exchangers, Water, Computer cooling, Cooling
Proceedings Papers

Heat Transfer Enhancement of a Heat Sink by Inclined Synthetic Jets for Electronics Cooling

Arya Ayaskanta, Longzhong Huang, Terrence Simon, Taiho Yeom, Mark North, Tianhong Cui
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A011, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17769
https://doi.org/10.1115/HT2013-17769
View Paper titled, Heat Transfer Enhancement of a Heat Sink by Inclined Synthetic Jets for Electronics Cooling
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Topics: Computer cooling, Heat sinks, Heat transfer, Jets
Proceedings Papers

An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications

Daniel Kearney, Justin Griffin
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A012, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17009
https://doi.org/10.1115/HT2013-17009
View Paper titled, An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications
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Topics: Computer cooling, Heat pipes, Heat, Fluids, Flux (Metallurgy), Electronic systems, Ethanol, Heat transfer, Power density, Surface roughness
Proceedings Papers

Use of an Inorganic Aqueous Solution to Prevent Non-Condensable Gas Formation in Aluminum Heat Pipes

Michael Stubblebine, Sean Reilly, Qi Yao, Ivan Catton
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T04A022, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17802
https://doi.org/10.1115/HT2013-17802
View Paper titled, Use of an Inorganic Aqueous Solution to Prevent Non-Condensable Gas Formation in Aluminum Heat Pipes
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Topics: Aluminum, Heat pipes, Fluids, Water, Heat, Hydrogen, Metals, Testing, Aluminum alloys, Coating processes