This paper presents an experimental investigation to study the thermal and material characterization of an array of composite copper-carbon nanotubes (CNT) micropillars for applications in passive two-phase cooling systems. These novel micropillar structures have a larger spacing at the base of the micropillars to provide a higher liquid permeability and mushroom-like structures on the top surface of the micropillars with a smaller spacing to provide a greater capillary pressure. First, composite copper-CNT micropillars are fabricated by an electrodeposition method on a patterned copper template. Then, cauliflower-like nanostructures are grown on the top surface of the micropillars using chronoamperometry technique to improve the capillary pressure and thermal performance of the micropillars. Finally, a series of tests are conducted to quantify the thermal performance of the fabricated micropillars. The results indicate that the performance of mushroom-like composite copper-CNT micropillars is significantly higher than those of copper micropillar arrays.
- Heat Transfer Division
Fabrication and Thermal Characterization of Novel Copper-CNT Micropillars for Electronics Cooling Applications
- Views Icon Views
- Share Icon Share
- Search Site
Ghanbari, S, & Darabi, J. "Fabrication and Thermal Characterization of Novel Copper-CNT Micropillars for Electronics Cooling Applications." Proceedings of the ASME 2017 Heat Transfer Summer Conference. Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems. Bellevue, Washington, USA. July 9–12, 2017. V001T08A008. ASME. https://doi.org/10.1115/HT2017-4935
Download citation file: