The new generation of integrated-circuit chips demands novel cooling techniques for enhancing device performance. Air-cooling techniques are not sufficient anymore to reach the necessary dissipation for these devices while liquid-cooling techniques have proved to be an efficient solution. The addition of nanoparticles to conventional cooling fluid changes its thermo-physical properties based on the type of the particle material, base fluid, particle volume fraction and size, pumping power, etc. The present study proposes a flow field pattern for a nanofluid-cooled heat sink in order to improve the heat transfer and the flow distribution based on a new design. Al2O3 - water nanofluid is the working fluid. The results show the comparison between the simple conventional use of water and the use of a nanofluid, by way of implementing critical factors for performance evaluation: thermal resistance, temperature uniformity, highest base temperature, and pressure drop. The analysis enables to determine that the heat sink thermal performance is definitely improved by the use of a nanofluid.

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