The new generation of integrated-circuit chips demands novel cooling techniques for enhancing device performance. Air-cooling techniques are not sufficient anymore to reach the necessary dissipation for these devices while liquid-cooling techniques have proved to be an efficient solution. The addition of nanoparticles to conventional cooling fluid changes its thermo-physical properties based on the type of the particle material, base fluid, particle volume fraction and size, pumping power, etc. The present study proposes a flow field pattern for a nanofluid-cooled heat sink in order to improve the heat transfer and the flow distribution based on a new design. Al2O3 - water nanofluid is the working fluid. The results show the comparison between the simple conventional use of water and the use of a nanofluid, by way of implementing critical factors for performance evaluation: thermal resistance, temperature uniformity, highest base temperature, and pressure drop. The analysis enables to determine that the heat sink thermal performance is definitely improved by the use of a nanofluid.
- Heat Transfer Division
Heat Sink Performance Improvement by Way of Nanofluids
- Views Icon Views
- Share Icon Share
- Search Site
Zúñiga-Cerroblanco, JL, Gonzalez-Valle, CU, Lorenzini-Gutierrez, D, Hernandez-Guerrero, A, & Cervantes de Gortari, J. "Heat Sink Performance Improvement by Way of Nanofluids." Proceedings of the ASME 2016 Heat Transfer Summer Conference collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing. Washington, DC, USA. July 10–14, 2016. V002T21A001. ASME. https://doi.org/10.1115/HT2016-1027
Download citation file: