Three-dimensional melting problems are investigated numerically with Lattice Boltzmann method (LBM). Regarding algorithm’s accuracy and stability, Multiple-Relaxation-Time (MRT) models are employed to simplify the collision term in LBM. Temperature and velocity fields are solved with double distribution functions, respectively. 3-D melting problems are solved with double MRT models for the first time in this article. The key point for the numerical simulation of a melting problem is the methods to obtain the location of the melting front and this article uses interfacial tracking method. The interfacial tracking method combines advantages of both deforming and fixed grid approaches. The location of the melting front was obtained by calculating the energy balance at the solid-liquid interface. Various 3-D conduction controlled melting problems are solved firstly to verify the numerical method. Liquid fraction tendency and temperature distribution obtained from numerical methods agree with the analytical results well. The proposed double MRT model with interfacial tracking method is valid to solve 3-D melting problems. Different 3-D convection controlled melting problems are then solved with the proposed numerical method. Various locations of the heat surface have different melting front moving velocities, due to the natural convection effects. Rayleigh number’s effects to the 3-D melting process is discussed.
- Heat Transfer Division
Lattice Boltzmann Method Simulation of 3-D Melting Using Double MRT Model With Interfacial Tracking Method
- Views Icon Views
- Share Icon Share
- Search Site
Li, Z, Yang, M, & Zhang, Y. "Lattice Boltzmann Method Simulation of 3-D Melting Using Double MRT Model With Interfacial Tracking Method." Proceedings of the ASME 2016 Heat Transfer Summer Conference collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing. Washington, DC, USA. July 10–14, 2016. V002T15A014. ASME. https://doi.org/10.1115/HT2016-7407
Download citation file: