The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to manage the increase of the dissipated heat. The traditional air-cooling may not meet the requirements, and therefore a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid, but these microchannels are often designed to be single-layer channels. In this paper, the laminar heat transfer and pressure loss in a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flowrates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics, and the parallel-flow layout is found to be better for heat dissipation when the pumping power is limited, while the counter-flow layout is better when a high pumping power is provided.
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ASME 2012 Heat Transfer Summer Conference collocated with the ASME 2012 Fluids Engineering Division Summer Meeting and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels
July 8–12, 2012
Rio Grande, Puerto Rico, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4478-6
PROCEEDINGS PAPER
Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling Available to Purchase
Gongnan Xie,
Gongnan Xie
Northwestern Polytechnical University, Xi’an, China
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Yanquan Liu,
Yanquan Liu
Xi’an Jiaotong University, Xi’an, China
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Weihong Zhang,
Weihong Zhang
Northwestern Polytechnical University, Xi’an, China
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Jun Zhao
Jun Zhao
Huawei Technologies Co., Ltd., Shenzhen, China
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Gongnan Xie
Northwestern Polytechnical University, Xi’an, China
Yanquan Liu
Xi’an Jiaotong University, Xi’an, China
Bengt Sunden
Lund University, Lund, Sweden
Weihong Zhang
Northwestern Polytechnical University, Xi’an, China
Jun Zhao
Huawei Technologies Co., Ltd., Shenzhen, China
Paper No:
HT2012-58021, pp. 575-583; 9 pages
Published Online:
July 24, 2013
Citation
Xie, G, Liu, Y, Sunden, B, Zhang, W, & Zhao, J. "Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling." Proceedings of the ASME 2012 Heat Transfer Summer Conference collocated with the ASME 2012 Fluids Engineering Division Summer Meeting and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer. Rio Grande, Puerto Rico, USA. July 8–12, 2012. pp. 575-583. ASME. https://doi.org/10.1115/HT2012-58021
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