The micro-scale heat transfer and ultrafast thermoelasticity of a gold-chromium film subjected to ultra-short pulse laser heating is investigated. To predicate the thermal response accurately, the ballistic motion and hot electron diffusion are adopted in the laser source term. The ultrafast thermoelasticity (UTE) model with the modified laser heat source is applied to solve ultrafast thermoelastic behaviors inside a two-layered thin-film and the effect of the contact conductance on the thermo-elastic fields is included in the analysis. It is found that the excessive concentration stress appears at the interface due to the contact conductance effect. Therefore, the mechanical failure or damage may occur at the interface during the very early stage of the heating process even though the thermal resistance is extremely small (as small as 10−7 m2K/W).
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ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4357-4
PROCEEDINGS PAPER
Analysis of Microscale Heat Transfer and Ultrafast Thermoelasticity in a Multi-Layered Metal Film
Tsung-Wen Tsai,
Tsung-Wen Tsai
Feng Chia University, Taichung, Taiwan
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Yung-Ming Lee,
Yung-Ming Lee
Feng Chia University, Taichung, Taiwan
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Yang-Hsu Liao
Yang-Hsu Liao
Feng Chia University, Taichung, Taiwan
Search for other works by this author on:
Tsung-Wen Tsai
Feng Chia University, Taichung, Taiwan
Yung-Ming Lee
Feng Chia University, Taichung, Taiwan
Yang-Hsu Liao
Feng Chia University, Taichung, Taiwan
Paper No:
HT2009-88081, pp. 87-95; 9 pages
Published Online:
March 12, 2010
Citation
Tsai, T, Lee, Y, & Liao, Y. "Analysis of Microscale Heat Transfer and Ultrafast Thermoelasticity in a Multi-Layered Metal Film." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer. San Francisco, California, USA. July 19–23, 2009. pp. 87-95. ASME. https://doi.org/10.1115/HT2009-88081
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