The heat transfer characteristics during flow boiling of deionized water in parallel microchannels are investigated. The silicon heat sinks contain an array of integrated heaters and diodes for localized heat-flux control and temperature measurement. The channel widths for the three different test pieces range from 250 μm to 2200 μm, with a nominal depth for all channels of 400 μm. The present study investigates the effects of the channel width and mass flux on the boiling performance. This study follows a previous study using a wetting dielectric liquid, and aims to understand the role of wetting since water is relatively non-wetting. From the results of the present study, a weak dependence of the boiling curve and heat transfer coefficient on mass flux was observed. Varying the channel width also does not have a strong effect on either the boiling curve or the heat transfer coefficient. The experimental results are compared to those obtained previously for a dielectric liquid. They are also compared with predictions from several correlations from the literature.
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ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4356-7
PROCEEDINGS PAPER
An Experimental Investigation of Microchannel Size Effects on Flow Boiling With De-Ionized Water
Bradley T. Holcomb,
Bradley T. Holcomb
Purdue University, West Lafayette, IN
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Tannaz Harirchian,
Tannaz Harirchian
Purdue University, West Lafayette, IN
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Suresh V. Garimella
Suresh V. Garimella
Purdue University, West Lafayette, IN
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Bradley T. Holcomb
Purdue University, West Lafayette, IN
Tannaz Harirchian
Purdue University, West Lafayette, IN
Suresh V. Garimella
Purdue University, West Lafayette, IN
Paper No:
HT2009-88329, pp. 897-905; 9 pages
Published Online:
March 12, 2010
Citation
Holcomb, BT, Harirchian, T, & Garimella, SV. "An Experimental Investigation of Microchannel Size Effects on Flow Boiling With De-Ionized Water." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment. San Francisco, California, USA. July 19–23, 2009. pp. 897-905. ASME. https://doi.org/10.1115/HT2009-88329
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