The ever increasing power dissipation requirements of electronic components and the need to provide reliable, cost-effective thermal solutions requires the thermal engineer to accurately understand the component’s thermal design power (TDP). The TDP is impacted not only by the power-performance characteristics of the component architecture, but also by the inherent thermal characteristics of the cooling solution. A suitable TDP definition thus requires a clear understanding of the transient thermal response (resistance and capacitance) of the cooling solution. In this paper, a simple electrical analogy impedance network model that resembles the component with cooling solution is developed. Correlation models to predict the resistance and capacitance for this impedance network are built based on easily available parameters such as heat sink mass, surface area, specific heat etc. The accuracies of these models are validated experimentally with data collected on a PCB with several different thermal solutions. Development of these correlation models eliminates the need for complex time consuming transient experiments to characterize the system thermal characteristics like capacitance, which allows faster, more realistic TDP definitions and ability to analyze multiple thermal designs quickly and accurately.
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ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4356-7
PROCEEDINGS PAPER
A Simple Model for Transient Thermal Behavior of Integrated Circuit Package Systems for Use in Determining a Thermal Design Power Available to Purchase
Julia C. Huang,
Julia C. Huang
Intel Corporation, Folsom, CA
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Deepak Ganapathy,
Deepak Ganapathy
Intel Corporation, Folsom, CA
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Shushanth Prabhu,
Shushanth Prabhu
Intel Corporation, Folsom, CA
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Ethan J. Warner
Ethan J. Warner
Intel Corporation, Folsom, CA
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Julia C. Huang
Intel Corporation, Folsom, CA
Niyati Pise
Intel Corporation, Folsom, CA
Deepak Ganapathy
Intel Corporation, Folsom, CA
Shushanth Prabhu
Intel Corporation, Folsom, CA
Ethan J. Warner
Intel Corporation, Folsom, CA
Paper No:
HT2009-88229, pp. 839-846; 8 pages
Published Online:
March 12, 2010
Citation
Huang, JC, Pise, N, Ganapathy, D, Prabhu, S, & Warner, EJ. "A Simple Model for Transient Thermal Behavior of Integrated Circuit Package Systems for Use in Determining a Thermal Design Power." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment. San Francisco, California, USA. July 19–23, 2009. pp. 839-846. ASME. https://doi.org/10.1115/HT2009-88229
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