A genetic algorithm based multi-objective thermal design optimization of liquid cooled offset strip fin heat sinks is presented. Using water and HFE-7000 as coolants, Matlab’s genetic algorithm and direct search toolbox functions were utilized to determine the optimal thermal design of the offset strip fin heat sink based on the total thermal resistance and power consumption under constant pressure drop. For a relatively small fin length, the total thermal resistance decreases with increasing fin length and aspect ratio α. For larger fin lengths, the total thermal resistance increases with increasing fin length whereas the power consumption continuously increases with increasing fin length and aspect ratio α for a given pressure drop. A plot of the Pareto front indicates a trade-off between the total thermal resistance and pumping power consumption.
Skip Nav Destination
ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4356-7
PROCEEDINGS PAPER
A Genetic Algorithm Based Multi-Objective Thermal Design Optimization of Liquid Cooled Offset Strip Fin Heat Sinks
Sidy Ndao,
Sidy Ndao
Rensselaer Polytechnic Institute, Troy, NY
Search for other works by this author on:
Yoav Peles,
Yoav Peles
Rensselaer Polytechnic Institute, Troy, NY
Search for other works by this author on:
Michael K. Jensen
Michael K. Jensen
Rensselaer Polytechnic Institute, Troy, NY
Search for other works by this author on:
Sidy Ndao
Rensselaer Polytechnic Institute, Troy, NY
Yoav Peles
Rensselaer Polytechnic Institute, Troy, NY
Michael K. Jensen
Rensselaer Polytechnic Institute, Troy, NY
Paper No:
HT2009-88039, pp. 755-763; 9 pages
Published Online:
March 12, 2010
Citation
Ndao, S, Peles, Y, & Jensen, MK. "A Genetic Algorithm Based Multi-Objective Thermal Design Optimization of Liquid Cooled Offset Strip Fin Heat Sinks." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment. San Francisco, California, USA. July 19–23, 2009. pp. 755-763. ASME. https://doi.org/10.1115/HT2009-88039
Download citation file:
13
Views
Related Proceedings Papers
Related Articles
Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization
J. Electron. Packag (September,2004)
Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
J. Electron. Packag (March,2016)
Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
J. Electron. Packag (September,2000)
Related Chapters
Design and Implementation of a Low Power Java CPU for IC Bank Card
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
Summary
Heat Transfer & Hydraulic Resistance at Supercritical Pressures in Power Engineering Applications
Design of Indian Pressurized Heavy Water Reactors
Global Applications of the ASME Boiler & Pressure Vessel Code