We present a methodology for optimizing footprint, metal mass and thermal performance of an aluminum extruded heatsink for cooling chipset microprocessors in server form-factor. The analysis is based on predefined volume flow rate of air at a constant temperature assumed to be available upstream of the package. The front-to-back cooling assumption covers the worst case ambient conditions, typical of chipset boundary condition in servers. We present studies covering a range of heatsink footprints in order to compare and minimize the heatsink footprint, at the same time satisfying thermal specification of the chipset microprocessor. The study also focuses on the system-level assessment of the optimum 60×40 mm2 footprint and corner cases by studying the effect of motherboard thermal conductivity as well as blockages on the heatsink case-to-ambient thermal resistance.

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