Enhancing heat transfer during the charge and discharge of solar thermal storage tanks is an ongoing technical challenge. The types of thermal storage systems considered in the present study comprise an immersed heat exchanger at the top of a solar thermal storage fluid. The discharge process of a thermal store with specified dimensions is numerically simulated over a range of Rayleigh numbers, 105 < RaD <107. The immersed heat exchanger is modeled as a two-dimensional isothermal cylinder which is situated near the top of a water-filled tank with adiabatic walls. An adiabatic shroud whose shape is parametrically varied is placed around the cylinder. In addition, the shroud is connected to an adiabatic baffle situated beneath the cylinder. Nusselt numbers are calculated for different shroud shapes at different Rayleigh numbers. Results show that the shroud is effective in increasing the heat transfer rate. Optimal shroud and baffle geometries are presented as well as qualitative flow results.
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ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4356-7
PROCEEDINGS PAPER
Effect of Shroud and Baffle on Heat Transfer in a Solar Thermal Storage Tank
S. K. S. Boetcher,
S. K. S. Boetcher
University of North Texas, Denton, TX
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F. A. Kulacki
F. A. Kulacki
University of Minnesota, Minneapolis, MN
Search for other works by this author on:
S. K. S. Boetcher
University of North Texas, Denton, TX
F. A. Kulacki
University of Minnesota, Minneapolis, MN
Paper No:
HT2009-88413, pp. 701-709; 9 pages
Published Online:
March 12, 2010
Citation
Boetcher, SKS, & Kulacki, FA. "Effect of Shroud and Baffle on Heat Transfer in a Solar Thermal Storage Tank." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment. San Francisco, California, USA. July 19–23, 2009. pp. 701-709. ASME. https://doi.org/10.1115/HT2009-88413
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