Gas turbine inlet temperatures have reached, for special applications, values near to 1700K, as a result, radiative effects must be considered in heat transfer studies. In consequence, optical properties estimation has to be faced, which has increased the complexity of the correlation currently used. An absortivity correlation for CO2 at low resolution spectra, available from literature, for high pressure by employing a tree regression analysis and logistic dose function approach is presented therein. The model applied for the spectral range of 2μm to 15μm and for pressures in the range of 0.5 atm to 10 atm and for temperatures in the range of 294K to 1390K. Associated error is compared with Hottel emissivity and high resolution line spectra data base (HITRAN).
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ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4356-7
PROCEEDINGS PAPER
Absortivity Correlation for CO2 at Elevated Pressures by Employing Tree Regression Analysis and Logistic Dose Functions
Y. M. Leo´n,
Y. M. Leo´n
Universidad Simo´n Boli´var, Caracas, Mir., Venezuela
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A. Tremante,
A. Tremante
Florida International University, Miami, FL
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F. Malpica
F. Malpica
Universidad Simo´n Boli´var, Caracas, Mir., Venezuela
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Y. M. Leo´n
Universidad Simo´n Boli´var, Caracas, Mir., Venezuela
A. Tremante
Florida International University, Miami, FL
F. Malpica
Universidad Simo´n Boli´var, Caracas, Mir., Venezuela
Paper No:
HT2009-88113, pp. 467-479; 13 pages
Published Online:
March 12, 2010
Citation
Leo´n, YM, Tremante, A, & Malpica, F. "Absortivity Correlation for CO2 at Elevated Pressures by Employing Tree Regression Analysis and Logistic Dose Functions." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment. San Francisco, California, USA. July 19–23, 2009. pp. 467-479. ASME. https://doi.org/10.1115/HT2009-88113
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