Analytical solution of hyperbolic heat conduction equation has so far been limited only to one-dimensional frameworks. With the expanding of the application range for the fast heat sources in microelectronic industries, the two-dimensional solution of non-Fourier heat conduction becomes increasingly important. This paper presents an exact solution of hyperbolic heat conduction equation for a finite plane with sides subjected to combined boundary conditions. In the mathematical model, the heating on boundaries is treated as an apparent heat source whereas sides of the plane with the second kind boundaries are assumed to be insulated. The important characteristic of the proposed solution is its simplicity.
Volume Subject Area:
Heat Transfer in Electronic Equipment
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